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Magnalytix and Foresite to Host Technical Webinar on SIR Testing and Functional Reliability

06/26/2025 | MAGNALYTIX
Magnalytix, in collaboration with Foresite Inc., is pleased to announce an upcoming one-hour Webinar Workshop titled “Comparing SIR IPC B-52 to Umpire 41 Functional & SIR Test Method.” This session will be held on July 24, 2025, and is open to professionals in electronics manufacturing, reliability engineering, and process development seeking insights into new testing standards for climatic reliability.

The Death of the Microsection

06/26/2025 | Bob Neves, Reliability Assessment Solutions, Inc.
I got my start out of college grinding and polishing PCB microsections. My thumbs are a bit arthritic today because of the experience (microsection grinders know what I mean). Back then, via structures were rather large, and getting to the center in six steps of grinding and polishing was easy compared to what my team has been doing recently at the lab.

Marcy's Musings: The Hole Truth—Via Integrity in an HDI World

06/17/2025 | Marcy LaRont -- Column: Marcy's Musings
This month, we’re talking about “the hole truth,” namely, via reliability in an HDI world. As I contemplated what it takes to get the “perfect” via, it got me thinking about what it takes to create the “perfect” magazine issue.

Advint Delivers Advanced Electroplating Training to Triangle Labs 

06/02/2025 | Advint Incorporated
During the last week of April, Advint Incorporated conducted a comprehensive two-day on-site electroplating training session for the technical team at Triangle Labs, Inc., a key innovator in the printed circuit board space. The training was structured to align with the demands of high-reliability plating processes suitable for RF and high-frequency substrates.

Indium to Feature Precision Gold-Based Die-Attach Preforms at IMS 2025

05/29/2025 | Indium Corporation
Indium Corporation® will feature its high-reliability, gold-based precision die-attach preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, June 15-19, in San Francisco, CA.
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