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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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AE Industrial Closes L3Harris Acquisition, Launches Rocketdyne

08/04/2026 | BUSINESS WIRE
AE Industrial Partners, LP, a private investment firm focused on technologies and services critical to national and economic security, has finalized the acquisition of the space propulsion, power and electronics units from L3Harris Technologies, and is launching the entity as Rocketdyne.

Global Electronics Association Strengthens Taiwan Technical Leadership in Advanced Electronic Packaging

08/03/2026 | Global Electronics Association
As advanced electronic packaging becomes increasingly important to enabling next-generation semiconductor innovation, including chiplet architectures, 3D integration, and advanced substrate technologies, the Global Electronics Association today announced the appointment of Jeffrey ChangBing Lee as Technology Solutions Lead Expert for Advanced Electronic Packaging (AEP) – Taiwan.

Foxconn Research Develops 34.1 Tbps Silicon Photonics Technology

07/30/2026 | Foxconn
Foxconn Research Institute, in collaboration with National Yang Ming Chiao Tung University, has developed a 34.132 Tbps ultra-high-capacity silicon photonics transmission technology designed to address growing data bandwidth demands driven by artificial intelligence (AI).

SPARK Microsystems Expands European Distribution Network with Alcom Electronics

07/30/2026 | BUSINESS WIRE
SPARK Microsystems, a Canadian fabless semiconductor company specializing in next-generation short-range wireless communications, announced the expansion of its distribution channel in Northwest Europe, welcoming Alcom Electronics to SPARK’s partner network.

Mega Circuit Chooses atg Flying Probe Technology for High-speed Electrical Test and Automation

07/31/2026 | atg Mycronic GmbH
Atg Mycronic GmbH and IEC USA confirm an order for an atg A7a, 8 head, double-sided, high speed, auto-load/unload system for true “lights-out” operation from Mega Circuit.
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