Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
SMTA South East Asia Technical Conference Half-Day Training Workshops
March 21, 2016 | SMTAEstimated reading time: 1 minute
The Surface Mount Technology Association (SMTA) is excited to announce six new half-day workshops for the South East Asia Technical Conference on Electronics Assembly. The event will be held April 12-14, 2016 at the Eastin Hotel in Penang, Malaysia. The workshops are scheduled for Tuesday, April 12.
New half-day technical training workshops will include:
- Designing the Cleaning Process within the PCB Assembly Operations
Instructor: Mike Bixenman, DBA, KYZEN Corporation
- Industry 4.0 Smart Factory and Design Collaboration with Manufacturing Partners
Instructor: Jay Gorajia, Mentor Graphics Corporation
- Solder Paste Evaluation (A review of How Solder Pastes are Evaluated)
Instructor: Neil Poole, Ph.D., Henkel Electronic Materials LLC
- Designing in Reliability by Assessing Contamination at the Component Interface
Instructor: Mike Bixenman, DBA, KYZEN Corporation
- It’s Time for Low Temperature-Low Temperatures Solders, New Development and Their Applications
Instructor: Ning-Cheng Lee, Ph.D., Indium Corporation
- An Overview of the Factors and Mechanisms Impacting Reliability in HALT
Instructor: Neil Poole, Ph.D., Henkel Electronic Materials LLC
The SE Asia Technical Conference on Electronics Assembly Technology is sponsored by the SMTA with support from the Persatuan Surface Mount Technology P. Pinang.
Click here for more information.
Contact Jenny Ng, jenny@smta.org, with questions or comments.
About SMTA
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
Share on:
Suggested Items
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Indium Elevates Two Leaders Advancing PCB Assembly Innovation
06/10/2025 | Indium CorporationWith its commitment to innovation and growth through employee development, Indium Corporation is pleased to announce the promotions of Wisdom Qu to Senior Product Manager for PCB Assembly Products and Kevin Brennan to Senior Product Development Specialist.
Indium Joins Virginia Tech Center for Power Electronics Systems Industry Consortium
06/03/2025 | Indium CorporationIndium Corporation®, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, has joined Virginia Tech’s Center for Power Electronics Systems (CPES), an industry consortium that supports power electronics initiatives to reduce energy use while growing capability.
Indium Promotes O’Leary to Director of Global Accounts
05/27/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to electronics, semiconductor, thin-film, and thermal management industries, announces the promotion of Brian O’Leary to Director of Global Accounts.
Indium to Feature Materials Solutions for Semiconductor Packaging and Assembly at ECTC
05/22/2025 | Indium CorporationIndium Corporation®, an industry leader in innovative materials solutions for semiconductor packaging and assembly, will feature its lineup of high-reliability products at the Electronics Component and Technology Conference (ECTC), taking place May 27-30 in Dallas, Texas.