Global Citizenship: What I’ve Learned About the American PCB Business
Global Sourcing Spotlight: The Best Products to Buy Offshore Through Global Sourcing
Nolan's Notes: The Rise (and Risk) of Data
APAC Leads Surface Mount Technology Market
March 24, 2016 | PRNewswireEstimated reading time: 1 minute
The surface mount technology market is expected to grow, at a CAGR of 9.84% during the forecast period between 2015 and 2020. One of the major growth drivers for the surface mount technology market is the miniaturization of electronics devices. With reduction in size of electronic components, high packing density is possible. The size of the circuit with miniaturized electronic components could be reduced by 30% than the conventional technique. Surface mount technology is majorly used in the consumer electronics industry, and this trend is expected to continue during the forecast period.
Surface mount technology for consumer electronica application is expected to grow at the highest CAGR
In the surface mount technology market, consumer electronics is estimated to grow at a high CAGR during the forecast period. Electronic devices such as cell phones, laptops, MP3 players, and GPS navigation systems have evolved due to the miniaturization of technology and revolutionary development of microelectronics. Hence, the demand for SMDs in applications related to consumer electronics is increasing and is expected to grow at a faster rate than the other applications during the forecast period.
APAC is the fastest-growing region in the surface mount technology market
The market in APAC is expected to grow at a high CAGR between 2015 and 2020. Growing electronic manufacturing activity, rising demand miniaturization of components, and growth in consumer and automotive electronics are driving the SMT market in the APAC region. Furthermore, increasing penetration of wireless communication standards and rising demand for 3G/4G network are boosting SMT demand in the telecommunication sector in this region.
Several primary interviews with market experts have been conducted across four major regions, namely, the North America, Europe, Asia-Pacific, and Rest of the World (the Middle East, Africa, and Latin America). The primary participants considered for the study are C-level executives, managers, and D-level executives of the Tier 1, Tier 2, and Tier 3 companies.
The key players in the market include Nordson Corporation (U.S.), Mycronic AB (Sweden), Fuji Machine Manufacturing Co., Ltd. (Japan), Electro Scientific Industries Inc. (U.S.), and Orbotech Ltd. (Israel), Hitachi High Technologies Corporation (Japan), Viscom AG (Germany), Juki Corporation (Japan), CyberOptics Corporation (U.S.), and ASM Assembly Systems GmbH & Co. KG (Germany).
Share on:
Suggested Items
PCB Design Software Market Expected to Hit $9.2B by 2031
11/21/2024 | openPRThis report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from USD 3.9 billion in 2024 to USD 9.2 billion by 2031.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.
IPC Celebrates National Apprenticeship Week with a Focus on Electronics Manufacturing Excellence
11/19/2024 | IPCIPC, a leading global electronics industry association and source for industry standards, training and advocacy, is proud to announce its participation in National Apprenticeship Week, scheduled for November 17-23, 2024.
IPC Introduces First Standard for In-Mold Electronics
11/18/2024 | IPCIPC announces the release of IPC-8401, Guidelines for In-Mold Electronics. IPC-8401 addresses in-mold electronics (IME) technology, providing industry consensus on guidelines for manufacturing processes, part structures, material selection, and production test methods to integrate printed electronics and components into 3D smart structures.
Disruptive Innovation and Generative AI Inventor, Kevin Surace, to Keynote IPC APEX EXPO 2025
11/15/2024 | IPCEach year, IPC APEX EXPO features industry’s most dynamic, innovative minds to deliver keynote presentations that are both educational and entertaining. IPC APEX EXPO 2025 will feature Kevin Surace, an internationally renowned futurist and generative artificial intelligence (AI) innovator.