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Murata to Acquire Sensoride Corporation

12/25/2024 | Murata
Murata Manufacturing Co., Ltd. announces that Murata Electronics North America, Inc., a subsidiary of Murata, has entered into an agreement to acquire Sensoride Corporation (hereinafter referred to as 'Sensoride') on December 20, 2024, U.S. time.

IPC Announces New Training Course: PCB Design for Military & Aerospace Applications

12/23/2024 | IPC
IPC announced the launch of a new training course: PCB Design for Military & Aerospace Applications.

Beyond Design: AI-driven Inverse Stackup Optimization

12/26/2024 | Barry Olney -- Column: Beyond Design
Artificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for complex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements.

Statistically Testing Inner Layer Yield Improvement Projects 

12/18/2024 | Dr. Patrick Valentine, Uyemura
Can we trust our measurement system to give us reliable data? Is it accurate, repeatable, and reproducible? Measurement is the foundation of quality. We measure for two primary reasons: to make decisions on product quality and to provide data that will inform continuous improvement projects. We can engage in continuous improvement projects if we are confident in our measurement systems.

SCHMID Group Unveils Enhanced InfinityLine H+ for Electroless Copper Deposition

12/16/2024 | SCHMID Group
The SCHMID Group, a global leader in high-tech solutions for the electronics industry, proudly announces significant updates to its flagship InfinityLine H+ Electroless Cu system. Specifically designed for the production of high- performance advanced packaging applications using mSAP and SAP processes, the system reflects SCHMID’s expertise in horizontal electroless copper deposition.
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