Alpha Assembly Solutions to Present at 2016 IPC Assembly and Reliability Conference

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Alpha Assembly Solutions, the world leader in the production of electronic soldering materials, will be presenting a technical paper “Methods for Minimizing Voiding in Surface Mount BGA and BTC Device Interconnects” at 2016 IPC Assembly and Reliability Conference which will be taken place in Thailand and Vietnam on April 26 and April 28 respectively.

The paper to be presented at IPC Thailand and Vietnam “Methods for Minimizing Voiding in Surface Mount BGA and BTC Device Interconnects” will be focuses on the evaluating the causes of voids and the methods of eliminating them.  Voids are an area of concern for the long term durability and functionality of electronic devices.  Voids near or at the interface of surface mount technology (SMT) component input/outputs (I/O’s), or the circuit board substrate can be highly probable initiators of crack propagation, leading to the high possibility of a field failure.

Six methods of reducing or eliminating voids in SMT applications will be discussed at these conferences.  Three of the techniques are process based adjustments and three involve the optimization of materials used in solder paste.  These methods include:

• Reflow profile optimization
• Use of vacuum during reflow
• Managing the solder paste deposit volume through stencil design
• Solder paste chemistry selection
• Choice of solder powder particle size distribution
• Use of solvent-free joining materials

For more information on Alpha’s vast product offering and capabilities, visit AlphaAssembly.com

TECHNICAL PAPER PRESENTATION:

Tuesday, 26 April 2016 | 15:15-16:00 | Bangkok, Thailand

Venue:  Miracle Grand Convention Hotel

Topic:   Methods for Minimizing Voiding in Surface Mount BGA and BTC Device Interconnects

Speaker: Tuck Weng Mok, Manager-Global Application Technology & Engineering, Alpha Assembly Solutions

Thursday, 28 April 2016 | 15:15-16:00 | Ho Chi Minh City, Vietnam

Venue: Pullman Saigon Centre

Topic:   Methods for Minimizing Voiding in Surface Mount BGA and BTC Device Interconnects

Speaker: P.H. Tan, Senior Application Engineer, Alpha Assembly Solutions

About Alpha Assembly Solutions

Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.

With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils.  It offers die attach product technologies to the power electronics segment in its Argomax®, Atrox™ and Fortibond™ brands.

For the LED segment, Alpha offers its Lumet™ products covering applications from die attach to systems assembly in the LED manufacturing process.  Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications. 

Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, visit AlphaAssembly.com.