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Congatec Showcases High-performance Embedded Building Blocks at ElectroneX 2025

04/29/2025 | congatec
congatec, a leading vendor of embedded and edge computing technology, will present its latest high-performance hardware and software building blocks at ElectroneX 2025, taking place at the Melbourne Convention and Exhibition Centre from May 7-8.

CCL Design, Ynvisible Announce Strategic Partnership to Deliver Scalable Printed Display Solutions

04/28/2025 | CCL Design
CCL Design will integrate Ynvisible's proprietary display technology into its global manufacturing infrastructure and technology portfolio.

Siemens, TSMC Extend Collaboration to Drive Semiconductor Design Innovation

04/25/2025 | Siemens
Siemens Digital Industries Software announced that the company has deepened longstanding collaboration with TSMC to drive innovation in semiconductor design and integration, enabling mutual customers to tackle the challenges of next-generation technologies.

Ansys Strengthens Collaboration with TSMC on Advanced Node Processes Certification and 3D-IC Multiphysics Design Solutions

04/24/2025 | PRNewswire
Through continued collaboration with TSMC, Ansys announced enhanced AI-assisted workflows for radio frequency (RF) design migration and photonic integrated circuits (PICs), and new certifications for its semiconductor solutions. Together,

Autodesk Donates $4.3 Million to Cornell University to Prepare students for an AI-powered future

04/24/2025 | Autodesk
Autodesk announced a $4.3 million gift to Cornell University’s College of Engineering and College of Architecture, Art, and Planning (AAP) to help prepare students for the future of work in an increasingly AI-driven world. The investment will fund a new Autodesk Cornell Engineering Design and Make Space in Upson Hall.
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