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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

Fresh PCB Concepts: Managing PCB Trace Width and Spacing

09/22/2026 | Team NCAB -- Column: Fresh PCB Concepts
As a fabricator, I know that trace width and spacing are some of the first items reviewed when determining whether a PCB can be manufactured reliably. They may look like simple dimensions in the design data, but the ability to reproduce them consistently depends on several factors, such as the circuit's location, the copper weight used, the design density, and any additional plating requirements. These can all change what is realistically achievable.

Flex Connections: Material Selection in Nickel vs. Copper Tabs

09/17/2026 | Zack Schaner -- Column: Flex Connections
Flexible printed circuits are being designed to do more than route signals. In many applications, the flex circuit must also provide robust electrical interfaces, mechanical reinforcement, and reliable transitions between the circuit and surrounding assemblies. One effective way to accomplish this is by integrating copper or nickel tabs directly into a flexible printed circuit.

Secure PCB Sourcing Is Not Enough

09/15/2026 | Ryan O'Connor, SOMACIS
Defense teams are paying much closer attention to where their PCB work goes. That’s a smart approach. Approved suppliers, secure data, domestic production, and proper certifications all matter. But these factors do not address the tougher question: Does this specific board actually fit the supplier’s process? This is where sourcing decisions often become too general. A supplier might be approved and certified, but that does not mean every complex defense board is right for their shop.

Evaluating Physical Process Parameters to Improve Copper Plating Distribution

09/11/2026 | Richard Nichols and Marko Mirkovic, GreenSource Engineering
Consistent copper thickness across panels directly affects etching accuracy, conductor geometry, electrical performance, and ultimately, product reliability. It is a persistent manufacturing challenge, and for PCB fabricators serving advanced markets—including RF applications, power electronics, and other high-performance technologies—electrolytic copper plating is one of the most critical process steps. In response, manufacturers typically modify shielding, rectification, or tooling, which may require an expensive hardware change.

MKS Highlights Laser and Chemistry Solutions at KPCA Show 2026

09/03/2026 | Atotech
MKS Inc. will showcase integrated manufacturing solutions in advanced packaging, package substrate, and printed circuit board (PCB) manufacturing at KPCA Show 2026 held at Songdo Convensia in Incheon, South Korea, from September 9–11. Visitors can meet MKS’ representatives at booth 201 in hall 3 and discover the company’s latest solutions for advanced electronics manufacturing.
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