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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

Optimizing Mixed Alloy Solder Pastes for Low Voiding and High PCB Reliability

10/21/2026 | Thuy Nguyen, Hongwen Zhang, PhD, Ronald C. Lasky, PhD, and Adam Murling, Indium
Solder joint voiding remains a critical reliability concern in electronic packaging, particularly for high-performance and safety-critical applications such as automotive electronics. Excessive voiding can adversely affect both thermal conductivity and mechanical strength, leading to elevated junction temperatures, accelerated fatigue failure under thermal cycling, and ultimately reduce product lifetime.

Knocking Down the Bone Pile: X-ray Inspection of Ball Grid Array Solder Joints

08/07/2026 | Nash Bell -- Column: Knocking Down the Bone Pile
Ball grid array (BGA) devices are ubiquitous in electronic products primarily due to their advantages, including compact packaging, greater durability than leaded devices, and improved performance from shorter signal paths. BGAs improve electrical performance by reducing inductance and capacitance between the internal silicon die and the PCB, resulting in superior signal integrity and faster operation speeds. BGAs also offer superior thermal performance by dissipating heat more effectively, reducing the risk of overheating.

Technica USA and DCT Tackle One of the Biggest Challenges in PCB Cleaning

07/29/2026 | Technica USA
As the industry prepares to explore the critical role of cleaning in today’s increasingly complex PCB manufacturing processes, Technica is gearing up for its upcoming Lunch & Learn event, taking place August 12–13, 2026.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

06/26/2026 | Marcy LaRont, I-Connect007
Amid AI, automation, advanced manufacturing, and an increasingly uncertain global business climate, our industry is moving at an electric pace. My must-reads for this week explore some of the ideas and technologies that help us keep up with so much change. Tom Kastner reminds us why staying focused may be one of the most valuable business skills, especially when navigating mergers and acquisitions. From Lithuania, robotics expert Aurelijus Beleckis makes a compelling case that automation is no longer just about ROI; it may be the key to long-term survival...

Punching Out: How to Stay Focused in Business and M&A

06/23/2026 | Tom Kastner -- Column: Punching Out!
It is getting harder and harder to stay focused these days. In fact, I started writing this column, got an email alert, and six days later, I realized I was still working on the first sentence. Among the hundreds of daily distractions, it is difficult for business owners to stay focused on the important matters. In the middle of all that noise, some owners feel like they have been dragged through a war zone, while others seem like Zen masters.
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