Dan’s Biz Bookshelf: ‘Elevate: Push Beyond Your Limits'
The Marketing Minute: The First Step to More Sales—Marketing
It’s Only Common Sense: Customer Service Is Sales in Disguise
Elekonta Marek Purchased Orbotech Diamond 8 Solder Mask System
April 20, 2016 | OrbotechEstimated reading time: 2 minutes
ORBOTECH LTD. has announced that Elekonta Marek GmbH & Co.KG., a European PCB manufacturer of MLB prototypes and QTA, has been successfully using the new Orbotech Diamond 8 Direct Imaging (DI) system for solder mask at its production facility in Gerlingen, Germany. This order was received and delivered during the third quarter 2015.
Orbotech Diamond 8 speeds up the solder mask production process for even the most complex designs. The driving force behind the system’s increased throughput and precise solder mask imaging is Orbotech’s unique SolderFast TechnologyTM. Utilizing a powerful light source engine, Orbotech Diamond 8 ensures consistent, high quality imaging, overcoming the most challenging surface topography variations as well as any distortions or abnormalities.
“As a market innovator in PCB prototyping, we are dedicated to continuously improving our production of sophisticated designs,” stated Mr. Lars Presche, General Manager of Elekonta Marek. “The high accuracy of Orbotech Diamond 8 solder mask DI has enhanced our ability to produce such designs, even those as small as 50µm. The system covers 100% of our production using a wide variety of solder mask types. This and other innovations from Orbotech have already boosted our throughput on unique and very complex prototypes.”
“With their reputation for bringing advanced solutions to their customers, it’s no surprise that Elekonta Marek is among our first European customers to have purchased and deploy the Orbotech Diamond 8,” said Mr. Hadar Himmelman, President of Orbotech West. ”We look forward to continue working together with Elekonta Marek, a long-time Orbotech customer, and supporting their needs well into the future.”
About Orbotech Diamond 8
Orbotech Diamond 8 is a fast, accurate solution for high-volume solder mask DI. Powered by Orbotech SolderFast Technology, Orbotech Diamond 8 is especially suited for designs with high complexity. Building on vast field-proven experience in patterning, the Orbotech Diamond 8 improves throughput, yield and productivity while decreasing total cost of ownership (TCO).
Orbotech SolderFast Technology employs a controlled wide UV spectrum to ensure fast throughput and high quality on a variety of solder resists. Unique one-pass exposure enables uniform solder mask imaging over the entire panel. Orbotech Diamond 8, with its sophisticated optical mechanism, including a patented light source with high energy illumination, enables high DOF (Depth-of-Focus) for consistent, precise imaging quality thus overcoming the most challenging surface topography variations as well as any distortion or abnormality. The system also offers advanced scaling modes for high precision registration, further improving throughput. Orbotech Diamond 8 delivers the most advanced image quality with no need to deploy an autofocus mechanism.
About Orbotech Ltd.
Orbotech Ltd. is a global innovator of enabling technologies used in the manufacture of the world’s most sophisticated consumer and industrial products throughout the electronics and adjacent industries. The Company is a leading provider of yield enhancement and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems and other electronic components. Virtually every electronic device is produced using Orbotech technology. For more information click here.
Share on:
Suggested Items
Silicon Mountain Contract Services Enhances SMT Capabilities with New HELLER Reflow Oven
07/17/2025 | Silicon Mountain Contract ServicesSilicon Mountain Contract Services, a leading provider of custom electronics manufacturing solutions, is proud to announce a significant upgrade to its SMT production capability with the addition of a HELLER 2043 MK5 10‑zone reflow oven to its Nampa facility.
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
SHENMAO Strengthens Semiconductor Capabilities with Acquisition of PMTC
07/10/2025 | SHENMAOSHENMAO America, Inc. has announced the acquisition of Profound Material Technology Co., Ltd. (PMTC), a premier Taiwan-based manufacturer of high-performance solder balls for semiconductor packaging.
KYZEN to Highlight Understencil and PCB Cleaners at SMTA Querétaro Expo and Tech Forum
07/09/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Querétaro Expo & Tech Forum, scheduled to take place Thursday, July 24, at Centro de Congresos y Teatro Metropolitano de Querétaro.
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.