-
-
News
News Highlights
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current Issue
The Legislative Outlook: Helping or Hurting?
This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
Advancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
CCI Eurolam Expands Distribution Area of Dow Chemical Products
May 12, 2016 | CCI EUROLAMEstimated reading time: Less than a minute
The CCI Eurolam Group, is pleased to announce that beginning in February 2016, CCI Eurolam has further expanded its distribution area of products from The Dow Chemical Company’s Electronic Materials Interconnect Technologies’ division, through The Dow Chemical Company’s subsidiary Dow Europe GMBH, into Germany and Benelux.
The Dow Chemical Company is a leading manufacturer of materials and technologies to the electronics and industrial finishing industries. Available products will include copper and nickel electroless plating baths, copper, nickel, gold, and tin electrolytic plating baths, immersion gold plating baths, cleaners, developers, and stripping and etching chemistry.
About CCI Eurolam Group
CCI Eurolam Group, celebrated its centenary in 2014, is an EMEA leading distributor of products used in the PCB and related industries. Its chemical division Chimie Tech Services (CTS) has been distributing surface treatment chemistry and equipment including Dow portfolio in France and Switzerland for more than 30 years. The Group distributes products from many of the world’s major manufacturers including DuPont, Pacothane Technologies, EMC, Arlon, Kingboard, Agfa, CAC, LCOA and its broad product offering is supported by distribution centres in Germany, the UK and France, with a team of dedicated technical service specialists.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Trouble in Your Tank: Understanding Interconnect Defects, Part 1
11/04/2025 | Michael Carano -- Column: Trouble in Your TankThis month, I’ll address interconnect defects (ICDs). While this defect continues to rear its ugly head, don’t despair. There are solutions, most of which center on process control and understanding the relationship of the chemistry, materials, and equipment. First, though, let’s discuss ICDs.
Target Condition: Distribution of Power—Denounce the Ounce
11/05/2025 | Kelly Dack -- Column: Target ConditionHave you ever wondered why the PCB design segment uses ounces to describe copper thickness? There’s a story behind all of this—a story that’s old, dusty, and more than a little absurd. (Note that I didn’t add “Like many of us.”) Legend has it that back in the days of copper tinkers and roofing tradesmen, the standard was set when a craftsman hammered out a sheet of copper until it weighed one ounce, when its area conveniently matched the square of the king’s foot.
WestDev Announces Advanced Thermal Analysis Integration for Pulsonix PCB Design Suite
10/29/2025 | WestDev Ltd.Pulsonix, the industry-leading PCB design software from WestDev Ltd., announced a major enhancement to its design ecosystem: a direct interface between Pulsonix and ADAM Research's TRM (Thermal Risk Management) analysis software.
Designers Notebook: Power and Ground Distribution Basics
10/29/2025 | Vern Solberg -- Column: Designer's NotebookThe principal objectives to be established during the planning stage are to define the interrelationship between all component elements and confirm that there is sufficient surface area for placement, the space needed to ensure efficient circuit interconnect, and to accommodate adequate power and ground distribution.
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.