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Yamaha Motor IM America Announces New President, GM
May 13, 2016 | Yamaha Motor IM AmericaEstimated reading time: 1 minute
Yamaha Motor IM America, Inc. announces the promotion of Mr. Takashi Kimura to the position of President, Yamaha Motor Intelligent Machinery America (YIMA).
Previously Mr. Kimura had been working for Yamaha Motor IM Suzhou Co.,Ltd. (YIMS) as Sales Manager before his promotion to President of Yamaha Motor IM America, Inc. (YIMA). He has been working for Yamaha for twenty‐four years, and his experience includes robotics and twelve years in SMT.
Mr. Naofumi Tanaka, who had previously served YIMA as President, Secretary and Treasurer, has been promoted to the position of General Manager, Overseas SMT Sales & Marketing Division for Yamaha IM (Intelligent Machinery).
About Yamaha Motor IM
Yamaha Motor Intelligent Machinery is a subdivision of Yamaha Motor Corporation, and has employed its core technologies to develop solder paste printers, printed circuit board inspection machines, flip chip hybrid placers and dispensers. Yamaha Motor IM offers a full line of machines for electric/electronic parts mounting and other production-line solutions to answer the diversifying needs of today’s electronics manufacturers. Yamaha Motor IM has sales and service offices in Japan, China, Southeast Asia, Europe, Brazil, and North America, providing a truly global sales and service network, delivering best in class on-site sales and service support for their customers.
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Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.