Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
Indium's VP of Technology to Chair Workshop on Pb-Free Soldering Reliability at ECTC
May 24, 2016 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will chair the professional development course, Materials Considerations for Achieving High Reliability Lead-Free Soldering, at the Electronic Components and Technology Conference (ECTC), on May 31-June 3 in Las Vegas, Nevada.
The professional development course will explore the detailed material considerations required for achieving high reliability in lead-free solder joints. Topics will include understanding the factors related to various failure modes, and how to select proper solder alloys and surface finishes. The course will be presented at the morning session on May 31.
Dr. Lee is a world-renowned soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulates for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with an emphasis on both high-performance and low cost of ownership.
About Indium Corporation
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, thermal management, and solar markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
Share on:
Suggested Items
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/15/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
SHENMAO Strengthens Semiconductor Capabilities with Acquisition of PMTC
07/10/2025 | SHENMAOSHENMAO America, Inc. has announced the acquisition of Profound Material Technology Co., Ltd. (PMTC), a premier Taiwan-based manufacturer of high-performance solder balls for semiconductor packaging.
KYZEN to Highlight Understencil and PCB Cleaners at SMTA Querétaro Expo and Tech Forum
07/09/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Querétaro Expo & Tech Forum, scheduled to take place Thursday, July 24, at Centro de Congresos y Teatro Metropolitano de Querétaro.
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.