-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Goepel Free Webinar on Flexible Integration of AOI Systems into the THT Process is Available on Demand
May 25, 2016 | GOEPEL ElectronicEstimated reading time: 1 minute
The new GOEPEL webinar, “Individuality Desired? Flexible Integration of AOI Systems into the THT Process,” is now available on demand.
For any technologists who have assessed the diversity of components in use today, it is obvious: THT components are still present in significant numbers, despite the march toward miniaturization and increases in integration density.
What are we doing to guarantee assembly quality in production when utilizing these components? Usually, it is done through manual means, and often not well tested at all. Neither is acceptable under today’s quality demands. This fact appears more problematic, as THT components are still in use in sensitive areas, especially in the field of power electrics.
This 60-minute free webinar will answer questions about typical manufacturing problems and requirements for THT inclusive production processes and provide key insights regarding the structure of an inline AOI system for component and solder joint inspection of THT assemblies.
Learn about various integration options for the shortest quality loop and maximum effectiveness. Find out how inspection systems can be connected to company-internal MES and traceability systems, and which challenges and opportunities exist for AOI systems with respect to labeling of assemblies.
Learn about the possibilities for inline integration are offered by AOI systems for THT assemblies, how these systems adapt to the given production situation and what labeling of work pieces and assemblies is necessary for unambiguous assignment of errors and traceability.
To view this webinar now, visit Goepel’s “Individuality desired? Flexible Integration of AOI systems into the THT process” event page.
About GOEPEL electronic
GOEPEL electronic is a worldwide leading vendor of innovative electronic and optical test and inspection systems, being the market leader for professional JTAG/Boundary Scan solutions for Embedded System Access (ESA). A network of branch offices, distributors and service partners ensures the global availability of the products as well as the support of system installations worldwide. Founded in 1991 and headquartered in Jena/Germany, GOEPEL electronic employs currently more than 230 employees and generated a revenue of 30 Million Euro in 2015. GOEPEL electronic has continuously been ISO9001 certified since 1996 and has been honoured with TOP-JOB and TOP-100 awards for being one of the best medium-sized companies in Germany. GOEPEL electronic’s products won several awards in recent years and are used by the leading companies in telecommunication, automotive, space and avionics, industrial controls, medical technology, and other industries.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.