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Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
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June 2016 Issue of SMT Magazine Available Now
June 2, 2016 | I-Connect007Estimated reading time: Less than a minute
Solder Paste Printing: Challenges and Solutions—The June 2016 issue of SMT Magazine discusses the challenges, best practices, and critical factors to consider in solder paste printing amid tighter tolerances and smaller pitches, lines and spaces.
Read the June issue of SMT Magazine, now on the virtual newsstand and available for delivery in your e-mailbox by subscribing here.
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