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Ucamco Updates Gerber Nested Step & Repeat Proposal
June 8, 2016 | UcamcoEstimated reading time: Less than a minute
Ucamco is extending the Gerber format to make it more efficient in handling fabrication and assembly panels. To allow the Gerber user community to review and comment on the new feature before it is cast in concrete a draft specification is made available for download on the Ucamco website. Vendors/Engineers who want to contribute are invited to send all comments and criticism to gerber@ucamco.com.
About Ucamco
Ucamco (formerly Barco ETS) is a market leader in PCB CAM software, photo plotting and direct imaging systems, with a global network of sales and support centres. Headquartered in Ghent, Belgium, Ucamco has over 25 years of ongoing experience in developing and supporting leading-edge photoplotters and front-end tooling solutions for the global PCB industry. Key to this success is the company's uncompromising pursuit of engineering excellence in all its products. Ucamco also owns the IP rights on the Gerber File Format through its acquisition of Gerber Systems Corp. (1998).
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Hanwha Aerospace to Collaborate with BAE Systems on Advanced Anti-jamming GPS for Guided Missiles
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EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).