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Without planes, designers would have to create thousands of traces to accomplish the same objectives. Power planes provide low impedance and stable power, and ground planes stabilize reference voltage, improve thermal performance, and help preclude EMI issues.
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Ucamco Updates Gerber Nested Step & Repeat Proposal
June 8, 2016 | UcamcoEstimated reading time: Less than a minute
Ucamco is extending the Gerber format to make it more efficient in handling fabrication and assembly panels. To allow the Gerber user community to review and comment on the new feature before it is cast in concrete a draft specification is made available for download on the Ucamco website. Vendors/Engineers who want to contribute are invited to send all comments and criticism to gerber@ucamco.com.
About Ucamco
Ucamco (formerly Barco ETS) is a market leader in PCB CAM software, photo plotting and direct imaging systems, with a global network of sales and support centres. Headquartered in Ghent, Belgium, Ucamco has over 25 years of ongoing experience in developing and supporting leading-edge photoplotters and front-end tooling solutions for the global PCB industry. Key to this success is the company's uncompromising pursuit of engineering excellence in all its products. Ucamco also owns the IP rights on the Gerber File Format through its acquisition of Gerber Systems Corp. (1998).
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Real Time with... SMTAI 2025: SPEA Bridges the Gap Between Legacy and Next-Generation Test Solutions
11/10/2025 | Real Time with...SMTAIEstablished in Italy in 1976, SPEA designs and manufactures automatic test equipment for various industries, including automotive, aerospace and defense, medical, consumer electronics, and energy. Recognized as one of Italy’s top-performing companies, SPEA continues to innovate in test automation technology. At SMTAI 2025, Dustin Warren, vice president of sales for SPEA America, discussed how the company is bridging the gap between older in-circuit test (ICT) systems and newer, more advanced testing solutions.
Lockheed Martin Revolutionizes AI Integration with STAR.OS™
11/08/2025 | Lockheed MartinLockheed Martin has made a major breakthrough in artificial intelligence (AI) technology with the introduction of the STAR.OS™ solution, a powerful new tool that enables different AI systems to work together smoothly and effectively.
Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
11/05/2025 | Leo Lambert -- Column: Learning With LeoHigh density interconnect (HDI) technology has been a cornerstone of miniaturized electronics since Hewlett-Packard introduced the first chip-scale implementation in 1982. Over time, HDI processes became central to organic flip-chip packaging in the semiconductor industry. Today, the convergence of IC substrates and system-level PCBs has accelerated the adoption of UHDI.
UHDI Fundamentals: UHDI Technology and Automated Inspection
11/03/2025 | Anaya Vardya, American Standard CircuitsFollowing up on the last article on integrating ultra high density interconnect (UHDI) PCB technologies and Quality 5.0, here we will do a deeper dive into the automated inspection component. UHDI applications demand extreme precision, with line/space dimensions below 25 µm and microvias below 30 µm. Automated inspection systems are essential to achieving the defect-free fabrication required at these scales, and legacy automated inspection systems are becoming obsolete and ineffective.
OSI Systems Reports Fiscal Q1 2026 Financial Results
10/31/2025 | BUSINESS WIREOSI Systems, Inc. announced its financial results for the first quarter of fiscal 2026.