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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Ucamco Updates Gerber Nested Step & Repeat Proposal
June 8, 2016 | UcamcoEstimated reading time: Less than a minute
Ucamco is extending the Gerber format to make it more efficient in handling fabrication and assembly panels. To allow the Gerber user community to review and comment on the new feature before it is cast in concrete a draft specification is made available for download on the Ucamco website. Vendors/Engineers who want to contribute are invited to send all comments and criticism to gerber@ucamco.com.
About Ucamco
Ucamco (formerly Barco ETS) is a market leader in PCB CAM software, photo plotting and direct imaging systems, with a global network of sales and support centres. Headquartered in Ghent, Belgium, Ucamco has over 25 years of ongoing experience in developing and supporting leading-edge photoplotters and front-end tooling solutions for the global PCB industry. Key to this success is the company's uncompromising pursuit of engineering excellence in all its products. Ucamco also owns the IP rights on the Gerber File Format through its acquisition of Gerber Systems Corp. (1998).
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Julia McCaffrey - NCAB GroupSuggested Items
Webinar Review, Part 2: Building the AI Backbone at IBM on Systems-level Packaging
04/20/2026 | Marcy LaRont, I-Connect007The second presentation in a recent Global Electronics Association’s Executive Pulse webinar series widened the lens on advanced packaging, moving beyond the component level to a systems-level view of how AI is reshaping the electronics landscape. Building on Dr. Hemanth Dhavaleswarupu of AMD’s previous discussion of chip-level packaging innovation, Dr. Jung Yoon of IBM explored the broader infrastructure implications, from the data center floor to the global supply chain.
From AI to AEP, an Impressive Array of Keynotes at APEX EXPO 2026
04/17/2026 | Marcy LaRont and Nolan Johnson, I-Connect007Each year at APEX EXPO, the Global Electronics Association provides an impressive lineup of keynote speakers to kick off the largest electronics manufacturing event in North America. This year included four keynote speeches, on topics ranging from the promise and peril of AI to the power of electronics, quantum computing, and the importance of heterogeneous integration in advanced electronics packaging.
AI, Connectivity, and Systems-Level Thinking: New Frontiers in Advanced Packaging
04/16/2026 | I-Connect007 Editorial TeamThe upcoming issue of Advanced Electronics Packaging Digest examines key developments shaping the next phase of electronics innovation, from the reliability challenges of AI-driven packaging to emerging connectivity standards and the broader systems-level implications of artificial intelligence.
RTX's Raytheon Completes First Flight Test for RAIVEN® Sensing System
04/15/2026 | RTXRaytheon, an RTX business, has successfully completed the first flight test of its RAIVEN® Staring system, an air-cooled sensor suite that delivers greater situational awareness and operator survivability, on a UH-60 Black Hawk helicopter.
HYFIX Raises $15M to Build U.S.-Made Chips for Next-Gen Drones and Robots
04/15/2026 | PRNewswireHYFIX Spatial Intelligence, Inc., a U.S.-based semiconductor company, announced a $15 million seed round to build and manufacture a new class of American-made chips designed to power high-precision drones and autonomous robots.