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PADS Paper: 10 Things to Know about Thermal DesignJune 8, 2016 | Mentor Graphics
Estimated reading time: Less than a minute
As designs get smaller, power densities at all packaging levels increase dramatically. Removing heat is critical to the operation and long-term reliability of electronics, and component temperatures within specification are the universal criteria used to determine the acceptability of a design.
Cooling solutions directly add weight, volume, and cost to the product, without delivering any functional benefit. What they provide is reliability. Without cooling, most electronic products would fail in a matter of minutes. Leakage current, and thus leakage power, goes up with smaller die-level feature sizes.
Because leakage is temperature-dependent, thermal design is more important. How should engineers who develop products with complex and/or high-power electronics ensure the thermal performance of their products while meeting other design criteria?
To answer this question, this PADS paper will take a look at 10 things you should know about thermal design of electronic products. To download this paper, click here.
I just finished counting the percentage of times in which artificial intelligence/machine learning/data analytics topics appeared in the I-Connect007 news this week. What do you think the percentage is? AI has moved well beyond a technical term; heck, it has clearly also eclipsed catch-phrase status. It seems a foregone conclusion that AI applications will be inserting themselves into manufacturing just as they are appearing in our handheld devices. Speaking of handhelds, that market seems to be growing as well. This week’s five must-reads include smartphone market data, telecom infrastructure development, a new white paper on the influence of data analytics, a report on the European market, and the launch of a new podcast series on PCB 3.0, a new design methodology.
DuPont today announced that Jon Kemp, President, DuPont Electronics & Industrial, has been named Chair of the Board of Industry Leaders of SEMI, a global industry association serving the electronics design and manufacturing supply chain.
With the seemingly endless ways that electronic products are worming their way into our lives, what was once “nice to own” is increasingly considered indispensable. The capabilities of these products have been driven by relentless improvements at every level of the manufacturing chain, from individual transistors (which are approaching Angstrom levels) to systems the size of buildings supporting Bitcoin mining and increasingly distributed AI products.
HARMAN, an automotive electronics technology company and subsidiary of Samsung Electronics Co., Ltd. focused on delivering consumer experiences at automotive grade, confirms it will continue as an Official partner of Scuderia Ferrari for a second Formula One season. The on-track marketing partnership extends to technology on the road, with Ferrari becoming the first automotive OEM to adopt a number of solutions from HARMAN’s in-cabin monitoring system, HARMAN Ready Care, for its next-generation road cars.
Maggie Benson was in an expansive mood. It had been almost three years since her grandfather asked her to take over Benson Electronics. By using Lean techniques, cost modeling the assembly process, and implementing continuous improvement, the company made significant profitability improvements.