Elementary, Mr. Watson: Rules of Thumb—Guidelines vs. Principles for PCB Design
Beyond Design: High-speed Rules of Thumb
Global PCB Connections: A Technical Overview of Long-flex Printed Circuit Boards
PADS Paper: 10 Things to Know about Thermal Design
June 8, 2016 | Mentor GraphicsEstimated reading time: Less than a minute
As designs get smaller, power densities at all packaging levels increase dramatically. Removing heat is critical to the operation and long-term reliability of electronics, and component temperatures within specification are the universal criteria used to determine the acceptability of a design.
Cooling solutions directly add weight, volume, and cost to the product, without delivering any functional benefit. What they provide is reliability. Without cooling, most electronic products would fail in a matter of minutes. Leakage current, and thus leakage power, goes up with smaller die-level feature sizes.
Because leakage is temperature-dependent, thermal design is more important. How should engineers who develop products with complex and/or high-power electronics ensure the thermal performance of their products while meeting other design criteria?
To answer this question, this PADS paper will take a look at 10 things you should know about thermal design of electronic products. To download this paper, click here.
Share on:
Suggested Items
sureCore Now Licensing its CryoMem Range of IP for Quantum Computing
11/26/2024 | sureCoresureCore, the memory specialist, has announced that it is now licensing its CryoMem™ suite of Memory IP that is designed for use at the extremely low temperatures required for Quantum Computing (QC) applications.
IPC Japan Puts More Focus on Collaboration, Standards Development, Advanced Packaging
11/26/2024 | Yusaku Kono, IPC Japan RepresentativeIn the past year, IPC has strengthened its relationships with key Japanese companies and government bodies. This was accomplished, in part, by a visit to Japan this past summer, where members of the IPC Asia team, punctuated by standards committee work last winter, forged stronger ties with government officials and companies involved in electronics manufacturing.
Subdued Electronics Industry Sentiment Continues in November
11/25/2024 | IPCIPC releases November 2024 Global Sentiment of the Electronics Manufacturing Supply Chain report
NEOTech Significantly Improves Wire Bond Pull Test Process
11/25/2024 | NEOTechNEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, proudly announces a major advancement in its wire bond pull testing process, reducing manufacturing cycle time by more than 60% while maintaining industry-leading production yields of over 99.99%.
PCB Design Software Market Expected to Hit $9.2B by 2031
11/21/2024 | openPRThis report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from $3.9 billion in 2024 to $9.2 billion by 2031.