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Designers Notebook: Layer Stackup Planning for RF Circuit Boards
PADS Paper: 10 Things to Know about Thermal Design
June 8, 2016 | Mentor GraphicsEstimated reading time: Less than a minute
As designs get smaller, power densities at all packaging levels increase dramatically. Removing heat is critical to the operation and long-term reliability of electronics, and component temperatures within specification are the universal criteria used to determine the acceptability of a design.
Cooling solutions directly add weight, volume, and cost to the product, without delivering any functional benefit. What they provide is reliability. Without cooling, most electronic products would fail in a matter of minutes. Leakage current, and thus leakage power, goes up with smaller die-level feature sizes.
Because leakage is temperature-dependent, thermal design is more important. How should engineers who develop products with complex and/or high-power electronics ensure the thermal performance of their products while meeting other design criteria?
To answer this question, this PADS paper will take a look at 10 things you should know about thermal design of electronic products. To download this paper, click here.
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