Global Sourcing Spotlight: How Global Sourcing Drives Innovation
One World, One Industry: IPC APEX EXPO 2025 Marks a Special Anniversary Year
Nolan’s Notes: Your Golden Ticket
BTU to Demo How Recipe Prediction Tool Helps Reduce Cost of Ownership at NEPCON West China
June 14, 2016 | BTU International, Inc.Estimated reading time: 1 minute
BTU International Inc. will showcase its RecipePro recipe generator software, jointly developed with Electronic Controls Design Inc. (ECD), as well as highlight the latest version of the Energy Pilot software and Industry 4.0 compliant solutions at NEPCON West China, which is scheduled to take place June 21–23, 2016, at the New International Convention & Exposition Center in Chengdu, China.
RecipePro is the only recipe generation tool in the industry to include convection rate in the recipe generator algorithm, pairing it perfectly with PYRAMAX’s closed-loop convection control. The integration of ECD’s recipe generator technology into BTU’s advanced reflow systems offers manufacturers a streamlined and effective approach to initial recipe generation for higher yield results. The profiler will reduce non-productive time by streamlining the set-up process. RecipePro is included with new Pyramax reflow ovens that are configured with convection control.
The Energy Pilot software saves manufacturers money whenever the oven is idle. Standby mode can save more than 25 percent. Sleep mode can be used for longer interruptions saving more than 40 percent. Long idle periods fully shut down the oven using hibernate mode. Recovery times are minimized using remote product sensors and SMEMA. Operation is fully automatic and results in an overall reduction in electrical, air and nitrogen consumption. The feature takes advantage of the Pyramax’s superior response time allowing the oven to return to ready very quickly, not disrupting product flow.
Energy Pilot and RecipePro are features of BTU’s proprietary Wincon operating system and are available to existing Pyramax users by upgrading Wincon to the latest version.
BTU will be in Booth C30.
Share on:
Suggested Items
Solderstar to Present Advanced Profiling Solutions at IPC APEX EXPO 2025
02/04/2025 | SolderStarSolderstar, a leading provider of profiling solutions for the electronics manufacturing industry, will exhibit at IPC APEX EXPO 2025, which will take place March 18-20, 2025, at the Anaheim Convention Center in California.
YINCAE Launches UF 120LA
02/04/2025 | YINCAEYINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With exceptional flowability into 20μ gaps, UF 120LA eliminates cleaning processes, reducing costs and environmental impact while ensuring superior performance across applications like BGA, flip chip, WLCSP, and multi-chip modules.
Incap India Invests in New SMT Technology
01/24/2025 | IncapIncap India has invested approximately EUR 1 million in a new SMT (surface-mount technology) production line at its third factory in Tumkur.
Indium to Feature Precision Au-Based Die-Attach Preforms at SPIE Photonics West
01/22/2025 | Indium CorporationIndium Corporation will feature its high-reliability, Au-based precision die-attach preforms for critical laser and RF applications at SPIE Photonics West, Jan. 28-30, in San Francisco, California. SPIE West is the world’s premier event for lasers, biomedical optics, biophotonic technologies, quantum, and optoelectronics.
Indium to Showcase Power Electronics Products at NEPCON Japan
01/14/2025 | Indium CorporationAs one of the leading materials providers in the electronics assembly industry, Indium Corporation® is proud to feature its lineup of high-reliability products for power electronics at NEPCON Japan, taking place January 22-24, in Tokyo, Japan.