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Scanfil to Restructure Operations in China
June 27, 2016 | ScanfilEstimated reading time: Less than a minute
Scanfil announced in the Interim Report on 29 April 2016 that measures to eliminate overlap and streamline the factory network have been started in China. As an outcome of these measures Scanfil Sweden AB’s Chinese subsidiary, Partnertech Electronics Co., Ltd. has on 27 June 2016 decided to cease the production at Dongguang plant in China. Production at Dongguang plant is estimated to end during the third quarter of 2016. Turnover of Partnertech Electronics Co., Ltd in 2015 was about EUR 19.5 million and operating loss about EUR 1.1 million. Part of the customer accounts of Dongguan will continue at Scanfil plants in Hangzhou and Suzhou.
Non-recurring costs related to the closure of the production is estimated to be approximately EUR 2 million. The respective negative cash impact is estimated at approximately EUR 1 million. Corresponding cost provision will be recognized in the second quarter of 2016.
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Henger Microelectronics Expands Global Footprint with Major Equipment Shipment to Southeast Asia
10/31/2025 |Henger Microelectronics has reached a major milestone in its global expansion strategy with the successful shipment of advanced plasma etching and cleaning systems, along with automation equipment, to multiple countries and regions across Southeast Asia. This achievement marks a significant step forward in the company’s international growth and reinforces its position as a leading force in the global plasma equipment industry.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
10/31/2025 | PRNewswireCephia, a startup building products using advanced AI computational imaging technologies and silicon sensors made from advanced metamaterials, formally launched with several pilot customers and $4 million in seed venture capital funding.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
10/31/2025 | NEDMEThe NW Electronics Design & Manufacturing Expo (NEDME) 2025 once again brought together the Pacific Northwest community for a full day of learning, networking, and industry connections.