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Happy’s Essential Skills: Design for Manufacturing and Assembly, Part 1
June 29, 2016 | Happy HoldenEstimated reading time: 9 minutes
The planning process central focus will be the tradeoffs between the loss and gain in performance for layout, fabrication, assembly and test versus the costs in these domains. Therefore, some major considerations will be the following sections:
- New product design process
- The role of metrics
- Layout tradeoff planning
Planning Concepts
Planning for design, fabrication and assembly (PDFA) is a methodology that addresses all those factors that can impact production and customer satisfaction. Early in the design process, the central idea of PDFA is to make design decisions to optimize particular domains, such as “producibility,” “assemble-ability,” “testability,” as well as fit to a product families, etc. in manufacturing. Planning takes place continuously in the electronic design environment (Figure 4). The data and specifications flow in one direction, from product concept to manufacturing. During the design process, 60%of the manufacturing costs are determined in the first stages of design when only 35% of the design engineering costs have been expended. The typical response is shown in Figure 5[2].
Figure 4: The electronics design environment.
Producibility
Producibility is now regarded as an intrinsic characteristic of a modern design. Like the concept of quality in manufacturing, it must be built in, not inspected in. Producibility must be designed in; it cannot be a "checkpoint" in the design process or inspected in by tooling.
NEW PRODUCT DESIGN
The keys to superior producibility in new product design can be found in the expanded design process. One of those key items is the role of metrics or data-based analysis of planning tradeoffs.
Figure 5: Design costs accumulate early in the Life Cycle compared to intrinsic manufacturing costs.
Expanded Design Process
The new expanded design process that incorporates planning, tradeoffs and manufacturing audits is shown in Figure 6 and Table 2. The process is made up of 12 separate functions that incorporate the planning and tradeoffs sections in this book.
Figure 6: Specifications determine product partitioning and producibility.
Table 2: The expanded electronics design process and its stages.
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Julia McCaffrey - NCAB GroupSuggested Items
Panasonic Industry will Double the Production Capacity of MEGTRON Multi-layer Circuit Board Materials Over the Next Five Years
09/15/2025 | Panasonic Industry Co., Ltd.Panasonic Industry Co., Ltd., a Panasonic Group company, announced plans for a major expansion of its global production capacity for MEGTRON multi-layer circuit board materials today. The company plans to double its production over the next five years to meet growing demand in the AI server and ICT infrastructure markets.
Sustainability and Selective Soldering
09/15/2025 | Dr. Samuel J. McMaster, Pillarhouse InternationalSustainability is more than just a buzzword for the electronics industry; it’s a key goal for all manufacturing processes. This is more than a box-ticking exercise or simply doing a small part for environmentally friendly processes. Moving toward sustainable solutions drives innovation and operational efficiency.
ASM Technologies Limited signs MoU with the Guidance, Government of Tamilnadu to Expand Design-Led Manufacturing capabilities for ESDM
09/15/2025 | ASM TechnologiesASM Technologies Limited, a pioneer in Design- Led Manufacturing in the semiconductor and automotive industries, announced signing of Memorandum of Understanding (MoU) with the Guidance, Government of Tamilnadu whereby it will invest Rs. 250 crores in the state to expand its ESDM related Design-Led Manufacturing and precision engineering capacity. ASM Technologies will acquire 5 acres of land from the Government of Tamilnadu to set up a state-of-the-art design facility in Tamil Nadu's growing technology manufacturing ecosystem, providing a strong strategic advantage and long-term benefits for ASM.
U.S. CHIPS Act Funding Detailed on SIA Website
09/12/2025 | Nolan Johnson, I-Connect007The U.S. CHIPS Act has moved well into the implementation stage in 2025. But where has that money gone? The Semiconductor Industry Association has been tracking these projects and provides details on its website. It was updated May. Among the five key programs being managed under CHIPS, two stand out as influencing advanced electronic packaging: the National Advanced Packaging Manufacturing Program (NAPMP), and the CHIPS Manufacturing USA Institute (MFG USA).
Zhen Ding Drives AI-Powered Digital Transformation
09/12/2025 | Zhen DingDriven by the surging demand for computing power fueled by AI, the semiconductor and PCB industries are forging closer integration, expanding their ecosystems, and pursuing shared growth. PCB has already become another NT$ trillion-dollar industry in Taiwan, growing in tandem with the semiconductor sector.