-
-
News
News Highlights
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Happy’s Essential Skills: Design for Manufacturing and Assembly, Part 1
June 29, 2016 | Happy HoldenEstimated reading time: 9 minutes
- Know Your History—Learn from the past: Returns, corrective action processes, recalls, etc. Know and understand problems and issues with current and past products.
- Standardize Design Methods & Tools: Standardize design, procurement, processes, assembly and equipment. Don’t redesign the wheel—use existing parts and assemblies and limit exotic or unique components.
- Simplify the Design—Methods for Part Reduction: Parts reduction is one of the best ways to reduce the cost of fabrication, assembling a product overhead and increase quality and reliability.
- Simplify the Design—Parts Commonality via Multi-use/Multi-functional Parts: Develop an approved or preferred parts lists or a standardized BOM. Use one-piece structures from molding, extrusions, castings and powder metals. Use multi-functional parts that perform more than one function.
- Design for Total Quality Management—Fundamental Principle of Lean: Lean supply, fabrication and assembly processes are essential design considerations. Develop and use standard guidelines appropriate for the process being performed. Know and apply lean principles to design manual operations for the capabilities of the operator. Practice ergonomics to maximize productivity and reduce operator fatigue and discomfort.
- Eliminate Waste: Overproduction, delays—waiting, transporting/moving, process inefficiencies, queues-inventories, unnecessary motions and defective products.
- Design for Parts Handling: Minimize handling to correctly position, orient and place parts to avoid multiple or complex assembly orientations.
- Design for Efficient Joining and Fastening: Avoid threaded fasteners when possible, consider alternatives; if used, minimize variety. Screws, bolts, nuts and washers are time-consuming to assemble and difficult to automate.
- Use Error-Proofing Techniques: Mistakes will happen. What can go wrong will go wrong. Use error-proofing techniques in product design and assembly.
- Design for Process Capabilities: Make unnecessary the tight tolerances and tolerances that are beyond the inherent capability of the manufacturing processes or operators in a continuous production situation.
- Design for Test, Repair & Serviceability: Defects will occur. Designing for ease of test and repair will make these processes more efficient, cost effective, and reliable. Failed products are often returned to the manufacturer for service and failure analysis. Where possible, use the production test equipment/setup for return analysis.
The foundation of a robust DfM system is a set of design guidelines and tasks to help the product team improve manufacturability, increase quality, reduce life cycle cost and enhance long term reliability. These principles need to be customized to your company's culture, products, and technologies, and based on a solid understanding of the intended production system—whether internal or external. The basis for these principles is “Measures of Performance & Metrics” where design choices have a score that can be shared by all.
Develop and use standard guidelines appropriate for the process being performed. Know and apply lean principles to design manual operations for the capabilities of the operator. Practice ergonomics to maximize productivity and reduce operator fatigue and discomfort.
Design Planning and Predicting Cost
The need for cost reduction in order to remain competitive is a principle responsibility of product planning. On the average, 75% of the recurring manufacturing costs are determined by the design drawing and specifications [2]. This was one of the conclusions found by an extensive study General Electric conducted on how competitive products were developed. Manufacturing typically determines production set-up, material management and process management costs (Figure 2), which are a minor part of the overall product cost.
Time-To-Market along with competitive prices can determine a product's ultimate success. The first of a new electronic product in the market has the advantages. By planning the PWB layout and taking into consideration aspects and costs of PWB fabrication and assembly, the entire process of design and prototyping can be done with minimum redesign (or respins).
Figure 2: Design determines the majority of the cost of a product.
Design Planning and Manufacturing Planning
Electronics is one of the biggest enterprises there is globally. It is common for design to be done in one hemisphere and manufacturing in another. It is also common for manufacturing to be done in a number of different places simultaneously. An integrated approach must be adopted when the intention is to rationalize fabrication and assembly as part of the entire production system and not as individual entities as shown in Figure 3. This dispersed manufacturing must be taken into consideration during the design planning and layout process. No finished product is ever better than the original design or the materials it is made from.
Figure 3: Fabrication and assembly rationalized by planning and design.
Page 2 of 4
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Panasonic Industry will Double the Production Capacity of MEGTRON Multi-layer Circuit Board Materials Over the Next Five Years
09/15/2025 | Panasonic Industry Co., Ltd.Panasonic Industry Co., Ltd., a Panasonic Group company, announced plans for a major expansion of its global production capacity for MEGTRON multi-layer circuit board materials today. The company plans to double its production over the next five years to meet growing demand in the AI server and ICT infrastructure markets.
Sustainability and Selective Soldering
09/15/2025 | Dr. Samuel J. McMaster, Pillarhouse InternationalSustainability is more than just a buzzword for the electronics industry; it’s a key goal for all manufacturing processes. This is more than a box-ticking exercise or simply doing a small part for environmentally friendly processes. Moving toward sustainable solutions drives innovation and operational efficiency.
ASM Technologies Limited signs MoU with the Guidance, Government of Tamilnadu to Expand Design-Led Manufacturing capabilities for ESDM
09/15/2025 | ASM TechnologiesASM Technologies Limited, a pioneer in Design- Led Manufacturing in the semiconductor and automotive industries, announced signing of Memorandum of Understanding (MoU) with the Guidance, Government of Tamilnadu whereby it will invest Rs. 250 crores in the state to expand its ESDM related Design-Led Manufacturing and precision engineering capacity. ASM Technologies will acquire 5 acres of land from the Government of Tamilnadu to set up a state-of-the-art design facility in Tamil Nadu's growing technology manufacturing ecosystem, providing a strong strategic advantage and long-term benefits for ASM.
U.S. CHIPS Act Funding Detailed on SIA Website
09/12/2025 | Nolan Johnson, I-Connect007The U.S. CHIPS Act has moved well into the implementation stage in 2025. But where has that money gone? The Semiconductor Industry Association has been tracking these projects and provides details on its website. It was updated May. Among the five key programs being managed under CHIPS, two stand out as influencing advanced electronic packaging: the National Advanced Packaging Manufacturing Program (NAPMP), and the CHIPS Manufacturing USA Institute (MFG USA).
Zhen Ding Drives AI-Powered Digital Transformation
09/12/2025 | Zhen DingDriven by the surging demand for computing power fueled by AI, the semiconductor and PCB industries are forging closer integration, expanding their ecosystems, and pursuing shared growth. PCB has already become another NT$ trillion-dollar industry in Taiwan, growing in tandem with the semiconductor sector.