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KIC: Find Out How to Reduce Production Costs at SMTA Chihuahua
July 6, 2016 | KICEstimated reading time: 1 minute
KIC today announced that it will exhibit at the SMTA Chihuahua Expo & Tech Forum, scheduled to take place Thursday, July 14 at the Casa Grande Hotel.
In Chihuahua, Mexico. Miguel Carbajal, KIC’s Sales Manager in Mexico, will be available to discuss KIC’s smart oven technologies.
KIC’s smart oven technologies lead to reduced production cost, higher quality and new capabilities that the electronic assembly market is starting to demand.
Over the last decade, reflow oven manufacturers have done a great job of making their ovens more stable, reliable and less expensive. Looking forward, the majority of additional customer value will be created in the utilization of the ovens, and that is the area where KIC has and continues to develop new technologies.
KIC’s technologies automatically measure the PCB profile and its match to the relevant process window. Share this continuous and near real-time process and traceability data with all authorized personnel and MES over the factory’s LAN. True process data helps the maintenance people troubleshoot and fix issues faster.
One exciting aspect of these smart technologies is that they are retrofitable on virtually all oven models at nearly any age. Now the entire factory can use smart oven technologies.
About KIC
Based in San Diego, KIC is the industry leader in automated thermal process tools and systems for reflow, wave, curing and semiconductor thermal processes. The company pioneered the development of oven profilers and process optimization tools, and then worked to create the next generation of thermal systems to help manufacturers improve the thermal process quality while reducing cost.
KIC products include the KIC K2, X5, KICstart2, ProBot, 24/7 Wave and the KIC RPI. With the introduction of cutting edge tools, the company continues to stay on the leading edge of process optimization and automatic thermal process systems, and has won numerous industry awards.
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