Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBs
Elementary Mr. Watson: Navigating RF—A Glide Path Approach to Design Success
Designers Notebook: Layer Stackup Planning for RF Circuit Boards
Würth Elektronik and Zuken Launch Component Libraries for CADSTAR
July 15, 2016 | ZukenEstimated reading time: 1 minute
Würth Elektronik, a manufacturer of electronic and electromechanical components and Zuken, a leader in PCB and IC package design, have added new component libraries for Zuken's CADSTAR tool.
Würth Elektronik will now provide free-of-charge component libraries of its passive components for Zuken’s CADSTAR design software. The libraries allow users to simply download the correct components and start designing, without needing to worry about creating the right footprint or mechanical dimensions. These details, as well as the electrical parameters, are defined within the libraries, which are updated regularly.
Starting with passive components, Würth Elektronik already plans to expand the library to include semiconductors, optoelectronics and electromechanical components.
Jochen Baier, Technical Marketing Manager at Würth Elektronik, said, “Würth Elektronik places great importance on high quality component libraries, to simplify and speed-up the design process for our customers.”
Jeroen Leinders, CADSTAR Distribution Manager at Zuken, added, “CADSTAR users now enjoy shorter implementation design time thanks to Würth component libraries in CADSTAR. With the need to keep up with ever-reducing design cycle times, the libraries reduce the time engineers must spend creating PCB footprints and schematic symbols.”
The libraries build on an existing partnership with Würth Elektronik’s PCB division, through which Würth Elektronik’s design rules and layer structures are incorporated into CADSTAR as free templates which can be applied during the layout process.
The new libraries are available free here and are also supplied with the regular CADSTAR updates.
Share on:
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/09/2025 | Andy Shaughnessy, Design007 MagazineTrade show season is wrapping up as we head into summer. Where has the time gone? I hope you all get the chance to take a vacation this year, because I know you’ve earned one. Speaking of which, when was my last vacay? If I can’t remember, it’s probably time for one. It’s been a busy week in electronics, with fallout from the back-and-forth on tariffs taking up most of the oxygen in the room. We have quite an assortment of articles and columns for you in this installment of Must-Reads. See you next time.
Imec Coordinates EU Chips Design Platform
05/09/2025 | ImecA consortium of 12 European partners, coordinated by imec, has been selected in the framework of the European Chips Act to develop the EU Chips Design Platform.
New Issue of Design007 Magazine: Are Your Data Packages Less Than Ideal?
05/09/2025 | I-Connect007 Editorial TeamWhy is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal data package for your design.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems
05/08/2025 | Cadence Design SystemsAt its annual flagship user event, CadenceLIVE Silicon Valley 2025, Cadence announced a major expansion of its Cadence® Millennium™ Enterprise Platform with the introduction of the new Millennium M2000 Supercomputer featuring NVIDIA Blackwell systems, which delivers AI-accelerated simulation at unprecedented speed and scale across engineering and drug design workloads.