-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLearning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Training New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
The Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Würth Elektronik and Zuken Launch Component Libraries for CADSTAR
July 15, 2016 | ZukenEstimated reading time: 1 minute
Würth Elektronik, a manufacturer of electronic and electromechanical components and Zuken, a leader in PCB and IC package design, have added new component libraries for Zuken's CADSTAR tool.
Würth Elektronik will now provide free-of-charge component libraries of its passive components for Zuken’s CADSTAR design software. The libraries allow users to simply download the correct components and start designing, without needing to worry about creating the right footprint or mechanical dimensions. These details, as well as the electrical parameters, are defined within the libraries, which are updated regularly.
Starting with passive components, Würth Elektronik already plans to expand the library to include semiconductors, optoelectronics and electromechanical components.
Jochen Baier, Technical Marketing Manager at Würth Elektronik, said, “Würth Elektronik places great importance on high quality component libraries, to simplify and speed-up the design process for our customers.”
Jeroen Leinders, CADSTAR Distribution Manager at Zuken, added, “CADSTAR users now enjoy shorter implementation design time thanks to Würth component libraries in CADSTAR. With the need to keep up with ever-reducing design cycle times, the libraries reduce the time engineers must spend creating PCB footprints and schematic symbols.”
The libraries build on an existing partnership with Würth Elektronik’s PCB division, through which Würth Elektronik’s design rules and layer structures are incorporated into CADSTAR as free templates which can be applied during the layout process.
The new libraries are available free here and are also supplied with the regular CADSTAR updates.
Suggested Items
Würth Elektronik Now an Infineon ‘Preferred Partner’
03/13/2025 | Wurth Elektronik eiSosWürth Elektronik, one of the leading manufacturers of electronic and electromechanical components, is broadening its collaboration with semiconductor manufacturers.
Elementary Mr. Watson: Ensuring a Smooth Handoff From PCB Design to Fabrication
03/13/2025 | John Watson -- Column: Elementary, Mr. WatsonAt the 2020 Tokyo Summer Olympics, the U.S. men's 4x100-meter relay team had high hopes of winning a medal. The team comprised some of the fastest sprinters in the world, but something went wrong. In a relay, four runners must smoothly pass their baton to the next runner inside a zone on the track. If a runner drops the baton or it’s passed outside the zone, the team risks disqualification. The U.S. team’s pass between the second and third runner was messy, slowing them down. By the time the last runner received the baton, the team had lost too much time. They finished sixth in their heat and didn’t qualify for the final.
Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI
03/12/2025 | Ventec International GroupVentec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.
TI Introduces the World's Smallest MCU, Enabling Innovation in the Tiniest of Applications
03/12/2025 | PRNewswireTexas Instruments (TI) introduced the world's smallest MCU, expanding its comprehensive Arm® Cortex®-M0+ MSPM0 MCU portfolio. Measuring only 1.38mm2, about the size of a black pepper flake, the wafer chip-scale package (WCSP) for the MSPM0C1104 MCU enables designers to optimize board space in applications such as medical wearables and personal electronics, without compromising performance.
Speaking the Same Language as Your Fabricator
03/12/2025 | Andy Shaughnessy, Design007 MagazineWe do indeed have a failure to communicate; designers and fabricators often seem to be talking past each other, which can lead to jobs being put on hold. We asked Jen Kolar, VP of engineering for Monsoon Solutions, and columnist Kelly Dack to share their thoughts on ways that we can break down the communication barrier between design and fabrication. As they point out, a design kickoff checklist and a solid review process can be invaluable tools in a designer’s toolbox.