Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

NEXT Semiconductor Technologies Collaborates with BAE Systems to Develop Next Generation Space-Qualified Chips

04/28/2025 | PRNewswire
NEXT Semiconductor Technologies is collaborating with BAE Systems to accelerate the insertion of its latest ultra-wideband antenna processor units (APUs) into high-performing radiation-hardened electronic subsystems to support future space missions.

Airbus Signs Definitive Agreement with Spirit AeroSystems

04/28/2025 | Airbus
Airbus SE has entered into a definitive agreement with Spirit AeroSystems for the acquisition of industrial assets dedicated to its commercial aircraft programmes.

Alphawave Semi Delivers Foundational AI Platform IP for Scale-Up and Scale-Out Networks

04/23/2025 | BUSINESS WIRE
Alphawave Semi, a global leader in high-speed connectivity and compute silicon for the world’s technology infrastructure, bolsters its leadership in foundational AI silicon connectivity subsystems through silicon proven chiplets and IP subsystems on advanced process nodes and package types. This is set to be showcased at the TSMC 2025 North America Technology Symposium.

Yamaha Boosts YRi-V AOI Productivity with 3D Component Update

04/22/2025 | Yamaha Robotics
Yamaha Robotics Europe SMT Section has introduced instantaneous 3D component update, included with the latest software release for YRi-V automatic optical inspection (AOI) systems, letting users optimise inspection programs without stopping production. 

In-Memory Computing: Revolutionizing Data Processing for the Modern Era

04/21/2025 | Persistence Market Research
In a world where milliseconds matter, traditional computing architectures often struggle to keep up with the massive influx of real-time data.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in