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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
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We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Kinsus 2Q16 Profits to Rise 48%
July 19, 2016 | DigitimesEstimated reading time: Less than a minute
IC substrate supplier Kinsus Interconnect Technology is expected to post an about 48% sequential increase in second-quarter profits, buoyed by new product rollouts by its mobile device clients.
According to Digitimes, Kinsus is involved in the supply chain for Apple's new iPhone slated for launch in September with shipments already kicking off in June. Kinsus has also ramped up shipments of flip-chip chip scale package (FC CSP) substrates for new smartphones from other vendors, the report indicated.
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