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Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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Kinsus 2Q16 Profits to Rise 48%
July 19, 2016 | DigitimesEstimated reading time: 1 minute
IC substrate supplier Kinsus Interconnect Technology is expected to post an about 48% sequential increase in second-quarter profits, buoyed by new product rollouts by its mobile device clients.
According to Digitimes, Kinsus is involved in the supply chain for Apple's new iPhone slated for launch in September with shipments already kicking off in June. Kinsus has also ramped up shipments of flip-chip chip scale package (FC CSP) substrates for new smartphones from other vendors, the report indicated.
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Brent Fischthal - Koh YoungSuggested Items
Top Business Groups Urge Congress to Extend, Expand Successful Semiconductor Tax Credit
05/14/2026 | SIAThe Semiconductor Industry Association (SIA) and a broad coalition of 17 other top business and trade groups in a letter urged Congress to extend the Advanced Manufacturing Investment Credit (AMIC) – a highly impactful tax credit for chip production that is set to expire at the end of this year – and expand it to cover semiconductor design and other critical R&D activities.
Siemens Expands EDA Software Access Through EuroCDP Project
05/14/2026 | SiemensSiemens has become the first software provider to sign a strategic framework agreement with the European Chips Joint Undertaking (Chips JU) which aims to bolster Europe's semiconductor industry by fostering collaboration between the EU, member states and the private sector, through the European Chips Design Platform (EuroCDP) project.
More Than a Field Trip: Young Students Step into the World of Electronics and Semiconductors
05/13/2026 | Michigan Tech Electronics HubThe energy is electric at Michigan Technological University as 164 fourth graders from Michigan’s western Upper Peninsula trade their traditional desks for a day of high-tech exploration. The students are here to pilot Stories & Semiconductors, a new educational series. By following the adventures of characters who solve problems through electronics, young students don’t just read about technology; they build it themselves.
ASE, WUS Announce Strategic Collaboration to Build Advanced AI Packaging Hub in Kaohsiung
05/08/2026 | ASE GroupAdvanced Semiconductor Engineering, Inc. (ASE) and WUS Printed Circuit Co., Ltd. (WUS) announced today a strategic collaboration for the construction of a state-of-the-art manufacturing facility in the Nanzih Technology Industrial Park, Kaohsiung.
FPGA AI Chip Market to Surpass $100M Shipments by 2031 Amid Rapid ASP Decline
05/07/2026 | JPRJon Peddie Research (JPR), the market research and consulting firm covering graphics, AI processors, and visual computing, released FPGAs in AI, a new market intelligence report analyzing the emerging class of field-programmable chips designed for AI inference at the edge and in the cloud, and for IoT.