It’s Only Common Sense: Stop Pitching, Start Listening
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
Dan’s Biz Bookshelf: ‘Growth Hacker Marketing’
Kinsus 2Q16 Profits to Rise 48%
July 19, 2016 | DigitimesEstimated reading time: Less than a minute
IC substrate supplier Kinsus Interconnect Technology is expected to post an about 48% sequential increase in second-quarter profits, buoyed by new product rollouts by its mobile device clients.
According to Digitimes, Kinsus is involved in the supply chain for Apple's new iPhone slated for launch in September with shipments already kicking off in June. Kinsus has also ramped up shipments of flip-chip chip scale package (FC CSP) substrates for new smartphones from other vendors, the report indicated.
Share on:
Suggested Items
AI Chips for the Data Center and Cloud Market Will Exceed US$400 Billion by 2030
05/09/2025 | IDTechExBy 2030, the new report "AI Chips for Data Centers and Cloud 2025-2035: Technologies, Market, Forecasts" from market intelligence firm IDTechEx forecasts that the deployment of AI data centers, commercialization of AI, and the increasing performance requirements from large AI models will perpetuate the already soaring market size of AI chips to over US$400 billion.
Imec Coordinates EU Chips Design Platform
05/09/2025 | ImecA consortium of 12 European partners, coordinated by imec, has been selected in the framework of the European Chips Act to develop the EU Chips Design Platform.
SIA Welcomes Legislation to Strengthen U.S. Semiconductor Manufacturing Credit
05/02/2025 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer welcoming House introduction of Building Advanced Semiconductors Investment Credit (BASIC) Act.
SEMI 3D & Systems Summit to Spotlight Trends in Hybrid Bonding, Chiplet Architecture and Geopolitical Dynamics
05/01/2025 | SEMILeading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, June 25-27, 2025, in Dresden.
Keysight EDA, Intel Foundry Collaborate on EMIB-T Silicon Bridge Technology for Next-Generation AI and Data Center Solutions
04/30/2025 | BUSINESS WIREKeysight Technologies, Inc. announced a collaboration with Intel Foundry to support Embedded Multi-die Interconnect Bridge-T (EMIB-T) technology, a cutting-edge innovation aimed at improving high-performance packaging solutions for artificial intelligence (AI) and data center markets in addition to the support of Intel 18A process node.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in