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Saline Lectronics Invests in a Stinger Dispensing System
August 9, 2016 | Saline Lectronics, Inc.Estimated reading time: 1 minute
Saline Lectronics, Inc. recently installed the Stinger on its DEK Horizon 03iX printer used on a high-volume SMT Line. The company plans to add the Stinger to its other DEK printers in the future.
The Stinger is a low-volume dispense module that can be attached to the camera carriage of a standard DEK printer. It provides dual functionality to the print platform for customers who require a number of glue dots to be dispensed on a mixed technology board for example. The Stinger eliminates the need to dispense adhesive by hand.
The Stinger enables Lectronics to automatically dispense adhesive without the need to purchase a separate, standalone dispensing system. Lectronics will utilize the Stinger for PCBs that are ex-posed to harsh or critical environments, as well as those with switches or connectors that require adhesive to better secure them on the PCB. Lectronics and its customers will greatly benefit from the tool’s precise repeatable dispensing.
“The Stinger’s in-line automated dispensing system will save an enormous amount of hand work and labor time due to its precision and repeatability,” commented Jon Hood, SMT Manager. "It will free up technicians to better tend to our SMT lines, and keep production running smoothly and efficiently.”
About Saline Lectronics, Inc. – Solution’s Provider
Saline Lectronics, Inc. is an electronics assembly supplier located in Saline, Michigan. The company specializes in complex, high-mix electronic printed circuit board and electro-mechanical box build as-semblies. In addition to its extensive knowledge of PCB assembly manufacturing, other strengths in-clude test development, DFM, DFT and prototyping through production lifecycle.
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Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.