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Conecsus Presents SMT Metals Waste Recycling Solutions at SMTAI 2016
August 18, 2016 | ConecsusEstimated reading time: 1 minute
Conecsus LLC will illustrate how the company processes wastes containing primarily tin, tin-zinc, lead, silver, gold, and copper, and converts them into usable metal products for sale into the global market, at the upcoming SMTA International 2016 Conference and Exhibition, September 27-28, 2016, at the Donald Stephens Convention Center in Rosemont, Illinois. Conecsus will be at Booth #818.
Conecsus’ Tom Mitchell, North American Business Manager, will discuss what Conecsus does and how its recycling technology benefits the SMT/PCB electronics manufacturer, how the system works, and how it represents a new way of dealing with metals-contaminated waste in an increasingly environmentally-conscious manufacturing world.
With patented, advanced recycling technologies, Conecsus keeps its customers compliant with local, state, and federal regulations while decreasing their carbon footprint and reportable waste streams. Conecsus, LLC is a sophisticated ‘green’ recycler and refiner of SMT solder/solder paste wastes and residues, as well as Tin, Lead, Silver, Gold, and Copper from a variety of manufacturing industries. Conecsus converts these wastes into usable metal products.
About Conecsus
Founded in 1980, Conecsus, LLC is a sophisticated ‘green’ recycler and refiner of SMT solder/solder paste wastes and residues, as well as Tin, Tin-Zinc, Lead, Silver, Gold, and Copper from a variety of manufacturing industries. Located in Terrell, Texas, USA, Conecsus converts these wastes into usable metal products. Conecsus’ mission is to provide innovative and high-quality industrial byproducts management, metal recovery, and recycling options that provide world-class value and service to our customers, and display respect and stewardship toward the environment. For more information, visit www.conecsusllc.com.
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Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
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Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
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