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In this issue, we discuss some of the challenges, pitfalls and mitigations to consider when designing non-standard board geometries. We share strategies for designing odd-shaped PCBs, including manufacturing trade-offs and considerations required for different segments and perspectives.
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Nine Dot Connects Presents Stack-up and Impedance Webinar August 31August 29, 2016 | Nine Dot Connects
Estimated reading time: 1 minute
How do you intuitively engineer good impedance controlled PCB stack-up and routing plans for each new design which meet all of their specific impedance control design requirements?
- Search on the Internet?
- Do hand calculations?
- Ask a friend?
- Always force the design into the same one or two because they worked in the past?
- Buy a very expensive and complex tool like Polar?
- “Feel” the best solution?
- Hire an “expert” to do it?
Can you intuitively visualize and understand what it’s doing and how to reliably use it?
How do you efficiently approach gathering the raw data to make the final choices?
This webinar, presented by Nine Dot Connects on August 31, will answer these questions, and many more.
As signal speeds increase the shortcomings of materials (like FR-4) become critical. Dielectric constants aren’t constant resulting in dispersion. Loss increases and is frequency dependent resulting in signal degradation over longer runs. Gathering information on lots of materials, tabulating all the information at various frequencies along with the specific thicknesses available, selecting optimal materials and adjusting stack-ups to compensate can be very time consuming and error-prone.
In this webinar, Nine Dot Connects’ Sr. Principle EE Jeff Condit will show you intuitively how various elements of a PCB’s structure and routing affect the electromagnetic fields and in turn the couplings, energies, and characteristic impedances of traces on it. Practical suggestions, methods, alternatives and solutions will be discussed.
Wednesday, August 31, 2016 at 11 am (PDT) / 2 pm (EDT)
For more information, or to register, click here.
Siemens Joins Semiconductor Education Alliance to Address Skills and Talent Shortage in Global Semiconductor Industry02/29/2024 | Siemens Digital Industries
Siemens Digital Industries Software announced today it has joined the Semiconductor Education Alliance to help build and nurture thriving communities of practice across the integrated circuit (IC) design and Electronic Design Automation (EDA) industries, from teachers and schools to universities, publishers, educational technology companies and research organizations.
At DesignCon, the I-Connect007 Editorial Team met with Brad Griffin, product marketing group director for the System Analysis Group at Cadence Design Systems. Brad explains how this analysis tool enables designers to address SI and PI issues early in the design process, before they become costly errors, and why he believes his late co-worker Dennis Nagel would be proud to see his efforts come to fruition.
Sondrel, a leading provider of ultra-complex chips for leading global technology brands, announces that it has secured two new contracts to supply Design Consultancy Services for a Network processor chip and a Radio Transceiver chip.
With the seemingly endless ways that electronic products are worming their way into our lives, what was once “nice to own” is increasingly considered indispensable. The capabilities of these products have been driven by relentless improvements at every level of the manufacturing chain, from individual transistors (which are approaching Angstrom levels) to systems the size of buildings supporting Bitcoin mining and increasingly distributed AI products.
Indium Corporation to Showcase Proven EV Products and High-Reliability Alloys at Productronica China02/28/2024 | Indium Corporation
As a materials pioneer and trusted partner in electric vehicle (EV) and e-Mobility manufacturing, Indium Corporation is proud to showcase its high-reliability alloys and soldering solutions at Productronica China, March 20-22, in Shanghai.