Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBs
Elementary Mr. Watson: Navigating RF—A Glide Path Approach to Design Success
Designers Notebook: Layer Stackup Planning for RF Circuit Boards
Nine Dot Connects Presents Stack-up and Impedance Webinar August 31
August 29, 2016 | Nine Dot ConnectsEstimated reading time: 1 minute
How do you intuitively engineer good impedance controlled PCB stack-up and routing plans for each new design which meet all of their specific impedance control design requirements?
- Search on the Internet?
- Do hand calculations?
- Ask a friend?
- Always force the design into the same one or two because they worked in the past?
- Buy a very expensive and complex tool like Polar?
- “Feel” the best solution?
- Hire an “expert” to do it?
Can you intuitively visualize and understand what it’s doing and how to reliably use it?
How do you efficiently approach gathering the raw data to make the final choices?
This webinar, presented by Nine Dot Connects on August 31, will answer these questions, and many more.
As signal speeds increase the shortcomings of materials (like FR-4) become critical. Dielectric constants aren’t constant resulting in dispersion. Loss increases and is frequency dependent resulting in signal degradation over longer runs. Gathering information on lots of materials, tabulating all the information at various frequencies along with the specific thicknesses available, selecting optimal materials and adjusting stack-ups to compensate can be very time consuming and error-prone.
In this webinar, Nine Dot Connects’ Sr. Principle EE Jeff Condit will show you intuitively how various elements of a PCB’s structure and routing affect the electromagnetic fields and in turn the couplings, energies, and characteristic impedances of traces on it. Practical suggestions, methods, alternatives and solutions will be discussed.
Date/Time
Wednesday, August 31, 2016 at 11 am (PDT) / 2 pm (EDT)
Register
For more information, or to register, click here.
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