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September 2016 Issue of SMT Magazine Available Now
September 2, 2016 | I-Connect007Estimated reading time: Less than a minute
The September 2016 issue of SMT Magazine looks into the different military and aerospace electronics technology and manufacturing challenges, and how they impact the PCB assembly industry.
Read the September issue of SMT Magazine, now on the virtual newsstand and available for delivery in your e-mailbox by subscribing here.
Suggested Items
Foxhole Group Boosts Life Science Capabilities with Accutron Partnership
09/03/2024 | Foxhole GroupFoxhole Group, a private investment firm focused on the industrial sector, announced today that it has added significant depth of expertise in life science and aerospace and defense capabilities to its Foxtronics EMS platform by partnering with the Faldu family to add Accutron to the company’s portfolio of EMS brands.
Marshall, Tech Mahindra to Explore Aerospace and Defense Collaboration
09/02/2024 | MarshallMarshall and Tech Mahindra, a leading global provider of technology consulting and digital solutions to enterprises across industries, have signed a Memorandum of Understanding (MoU) to identify and develop opportunities to work together across the aerospace and defense domains.
A Less Expensive Defense and Aerospace PCB Fab Startup
08/20/2024 | Alex Stepinski, Stepinski GroupEditor’s note: Investing in a new printed circuit board fabrication startup is not for the faint of heart or the light of wallet. Standing up a new “high-tech” PCB fab facility capable of becoming qualified for aerospace and defense work typically takes a minimum investment of $50 million. However, Alex Stepinski says entering the defense and aerospace markets with a new PCB fabrication start-up facility far under this prohibitive cost benchmark is possible when good partnerships, innovation, and sound engineering design enter from the beginning. In this article, Alex Stepinski outlines just how this can be achieved.
USPACE and EgSA to Form Aerospace Joint Venture in Egypt
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UHDI Fundamentals: UHDI Applications for Aerospace
08/13/2024 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology refers to advanced manufacturing processes used to create extremely compact and highly efficient electronic circuits at the sub-1-mil line and space level. In aerospace applications, UHDI is crucial due to the stringent requirements for weight, reliability, and performance in a challenging environment.