Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Techcon Systems to Exhibit at FEICA Conference in Vienna, Austria
September 8, 2016 | Techcon SystemsEstimated reading time: 1 minute
Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, is exhibiting at the FEICA 2016 Conference and EXPO, taking place September 7-9, 2016 in Vienna, Austria.
Techcon Systems will discuss its new Custom Filling Service, where the company can fill one part or multi-component liquid materials into just about any container, bag, tube, cartridge, syringe, or bottle. As part of the Custom Filling Service, Techcon also provides accurate mixing equipment and dry plastic containers.
As part of the Custom Filling Service, Techcon also offers repackaging services, which are customized and designed to meet the requirements of the individual dispensing application. The entire know-how of the dispensing experts will be integrated and accomplished by user-friendly, dispensable one- and multi-component packaging systems.
About Techcon Systems
Techcon Systems was established in 1961 to service industrial manufacturing markets and has continued to be a leader in fluid dispensing systems and products. In 1996, OK International acquired Techcon Systems, providing a strong global sales channel, with direct subsidiaries in the UK. Today, Techcon represents OK International’s Industrial Product Division. Currently focusing on fluid dispensing systems, Techcon’s components are used in medical, automotive, telecommunications, aerospace, and industrial applications worldwide, helping to improve manufacturing processes and increase the customers’ bottom lines. Techcon offers an array of fluid dispensing products and provides dispensing components ranging from disposable accessories to complete microprocessor-controlled dispensing systems, and precision valves.
Share on:
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/27/2025 | Nolan Johnson, I-Connect007While news outside our industry keeps our attention occupied, the big news inside the industry is the rechristening of IPC as the Global Electronics Association. My must-reads begins with Marcy LaRont’s exclusive and informative interview with Dr. John Mitchell, president and CEO of the Global Electronics Association. For designers, have we finally reached the point in time where autorouters will fulfill their potential?
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
RTX, the Singapore Economic Development Board Sign MOU Outlining 10-year Growth Roadmap
06/20/2025 | RTXRTX and the Singapore Economic Development Board (EDB) have signed a Memorandum of Understanding (MoU) which outlines a 10-year roadmap to further long-term strategic collaboration in Singapore.
Indra Signs Agreement with AXISCADES to Boost Production of Cutting-Edge Systems in India
06/18/2025 | PRNewswireParis Air Show -- Indra and the Indian technology company AXISCADES have signed an agreement to collaborate on the production of solutions for the aerospace and defense markets.
GKN Aerospace Delivers First High Voltage EWIS System for Clean Aviation’s SWITCH Project
06/16/2025 | GKN AerospaceGKN Aerospace has completed and delivered the first high voltage Electrical Wiring Interconnection System (EWIS) for the Clean Aviation SWITCH project.