-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueBreaking High-speed Material Constraints
Do you need specialty materials for your high-speed designs? Maybe not. Improvements in resins mean designers of high-speed boards can sometimes use traditional laminate systems. Learn more in this issue.
Level Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
Opportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
Transline Technology is Bullish on Design Engineers
September 16, 2016 | Barry Matties, I-Connect007Estimated reading time: 6 minutes
Matties: We saw a trend starting, but didn't pay attention until 2000–2001, when the crash came.
Savalia: That's when people realized.
Matties: It was like a light switch.
Savalia: Yes. That's why in '96 and '97 we changed our strategy to high-end RF/microwave. Our business still went down until 2007, but from 2007 on our revenue has been growing a minimum of 10% a year.
Matties: When you look at capital investment into your facility, what sort of technology do you look at to carry you to the future?
Savalia: Last year we changed our chemical processing equipment, and we also invested in an AOI. This year at IPC APEX EXPO, we were reviewing new LDI machines.
Matties: When you look at a supplier for that, what are the important characteristics you look for? Is it just the technology, or is it the reputation of the company behind it?
Savalia: The reputation, technology, everything. Because we work with RF and microwave material that shrinks and expands, the machine has to be flexible to adjust that technology.
Matties: When you talked about the chemistry earlier, what was the behind that change?
Savalia: We didn’t change the chemistry, but the machine itself. We have four different etchers for the different metals and different chemistry in each.
Matties: Who did you choose for your equipment?
Savalia: Chemcut. Now we're looking at Orbotech for LDI.
Matties: There's also some new technology for LDIs from companies like Schmoll and a few others, have you looked at those?
Savalia: Yes, at APEX I saw them at three or four different vendors. It was quite a few. We're not 100% sure yet. There are some good machines to choose from.
Matties: Any final advice you would give buyers about buying RF and microwave circuit boards?
Savalia: Mostly look at the quality and service, not only price, especially for the high-end product. When design engineers design the circuit board and they go for a cheap board, then the product fails and they have to go to another place while the engineer is still waiting for the product.
Matties: Chris, I appreciate your spending time with me today.
Savalia: Thank you very much.
Page 2 of 2Suggested Items
Terran Orbital’s GEOStare SV2 Captures 3 Years of Success in High-Resolution Imaging
05/17/2024 | BUSINESS WIRETerran Orbital Corporation, a global leader in satellite-based solutions primarily serving the aerospace and defense industries, celebrates the 3rd anniversary of its successful GEOStare SV2 mission. Launched on May 15, 2021, from NASA’s Kennedy Space Center in Florida, GEOStare SV2 has surpassed expectations, delivering exceptional results for commercial satellite imagery.
Indium Experts to Present on High-Temperature, Lead-Free Solder Paste and High Reliability Liquid Metal Alloys Poster at ECTC
05/16/2024 | Indium CorporationIndium Corporation Research Associate Kyle Aserian will deliver a presentation at the 74th Electronic Components and Technology Conference (ECTC) on May 31, in Denver, Colorado.
Siemens, Foxconn Team Up to Optimize Forward-thinking Manufacturing
05/16/2024 | FoxconnSiemens AG, a leading technology company, and Hon Hai Technology Group (Foxconn), the world’s largest electronics manufacturer, have signed a memorandum of understanding (MoU) to drive digital transformation and sustainability in smart manufacturing platforms.
TactoTek Licenses IMSE Technology to Polestar for Sustainable Electronics Design Innovation
05/15/2024 | TactoTekPolestar, the Swedish electric performance car brand, and Finnish smart surface pioneer TactoTek, have entered a collaboration to explore integration of Injection Molded Structural Electronics (IMSE) technology into Polestar’s vehicle programs.
SiPearl: Partnership with Samsung Electronics for built-in HBM in Rhea
05/14/2024 | BUSINESS WIRESiPearl, the company building the high-performance low-power European microprocessor for HPC and AI inference, has signed a partnership with Samsung Electronics Co. Ltd., a world leader in advanced memory technology, to equip its Rhea series with Samsung’s advanced memory solution ideal for HPC and AI applications.