Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
KYZEN to Present Innovations to Address the Challenges of Cleaning Highly Dense Electronic Hardware at IEMT-EMAP 2016
September 16, 2016 | KyzenEstimated reading time: 1 minute
KYZEN is will exhibit and present during the conferences at IEMT-EMAP 2016, which is scheduled to take place September 20-22, at the G-Hotel in Penang, Malaysia. KYZEN Sdn Bhd's Technical Sales Manager, TC Loy, will present the paper authored by Mike Bixenman, MBA, DBA and Jason Chan, entitled, “Advanced Packaging and Electronic Assembly Cleaning Fluid Innovation.”
The miniaturization of modern electronics decreases conductor widths, which can create higher risk to insulation failure. As distances between conductors are reduced, electronic hardware is more vulnerable to insulation failure, higher voltage gradients and easier to form a corrosion cell. Inter-conductor spacing influences the migration rate and is inversely related with conductor width. Acceleration factors create multiple stresses due to activation energy, temperature, humidity and voltage.
Removal of process residues is needed to reduce electrochemical migration. Cleaning electronic hardware is well-known. The challenges with cleaning highly dense hardware are many. Low standoff gaps prevent flux outgassing and can underfill the bottom termination with active flux residue. Mixed metals can react with alkaline cleaning agents, which can result in galvanic corrosion. The time and energy needed to reach the residue and remove contamination under the component requires high pressure spray impingement and increased wash time.
The purpose of this research is to present cleaning technology innovations to address the challenges of cleaning highly dense electronic hardware. Mr. Loy will present the material compatibility on mixed metals, cleaning performance and Surface Insulation Resistance of the residue under the bottom termination.
About KYZEN
KYZEN is a global leader in providing environmentally responsible, RoHS compliant precision cleaning chemistries for industries ranging from electronics and advanced packaging to metal finishing and aerospace applications. Since its founding in 1990, KYZEN’s innovative cleaning technologies, scientific expertise and customer support have been repeatedly recognized with the industry’s most prestigious awards. For more information, click here.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Electrodeposited Copper Foils Market to Grow by $11.7 Billion Over 2025-2032
09/18/2025 | Globe NewswireThe global electrodeposited copper foils market is poised for dynamic growth, driven by the rising adoption in advanced electronics and renewable energy storage solutions.
Breakthrough in Non-Contact Solder Removal Earns Kurtz Ersa 2025 Mexico Technology Award at SMTA Guadalajara
09/18/2025 | Kurtz Ersa Inc.Kurtz Ersa Inc., a leading supplier of electronics production equipment, is proud to announce that it has been awarded a 2025 Mexico Technology Award in the category of Rework & Repair for its HR 600P Automatic Rework System.
A.R.T. Invests in Latest Equipment to Further Enhance Electronics Training Facilities
09/17/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T.), a leading independent IPC-accredited training provider, has announced a series of new equipment investments at its state-of-the-art training centre.
Richardson Electronics Appoints Daniel Albers to Drive Made-in-USA Contract Manufacturing Expansion
09/17/2025 | Globe NewswireRichardson Electronics, Ltd., a global provider of engineered solutions for the green energy, power management, and custom display markets, announced the appointment of Daniel Albers to spearhead business development for its expanded, Made-in-USA contract manufacturing efforts.
STMicroelectronics to Advance Next-generation Chip Manufacturing Technology with New PLP Pilot Line in Tours, France
09/17/2025 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, today announced new details regarding the development of the next generations of Panel-Level Packaging (PLP) technology through a pilot line in its Tours site, France, which is expected to be operational in Q3 2026.