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Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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Better to Light a Candle
Column from: Marc Carter
Marc Carter has worked in the electronics interconnection industry since 1984 in a variety of roles in fabrication and assembly materials, processes, environmental compliance, and supply chain management activities around the world. He has had the honor and privilege of working with and learning from many of the true giants of this industry in multiple functions over many years. His experience includes a major mil-aero OEM, field and development work at materials suppliers to the printed circuit industry, and an educational stint as the sole proprietor of a manufacturer’s agency representing multiple high-tech milaero material suppliers.