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Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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Maxed Out
Column from: Clive
Clive "Max" Maxfield received his BSc in Control Engineering in 1980 from Sheffield Hallam University, England and began his career as a designer of central processing units (CPUs) for mainframe computers. Over the years, Max has designed everything from silicon chips to circuit boards and from brainwave amplifiers to steampunk Prognostication Engines (don't ask). He has also been at the forefront of electronic design automation (EDA) for more than 35 years.