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Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
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Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
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Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
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Digital Transformation
Column from: Team Siemens
David Wiens:
Over the past 35+ years, David Wiens has held various engineering, marketing and management positions within the EDA industry. His focus areas have included advanced packaging, high-speed design, routing technology and integrated systems design. He is currently the product manager for the Xpedition Enterprise portfolio of products for electronics systems design. He holds a B.S. in computer science degree from the University of Kansas.
AJ Incorvaia is senior vice president, Electronic Board Systems Division, Siemens Digital Industries Software.
Steph Chavez is senior printed circuit engineer with three decades’ experience. In his current role as a senior product marketing manager with Siemens EDA, his focus is on developing methodologies that assist customers in adopting a strategy for resilience and integrating the design-to-source intelligence insights from supply frame into design for resilience. He is an IPC Certified Master Instructor Trainer (MIT) for PCB design, an IPC Certified Advanced PCB Designer (CID+), and a Certified Printed Circuit Designer (CPCD). He is chairman of the Printed Circuit Engineering Association (PCEA).