Below the Surface

April 20, 2026

Below the Surface: Looking Ahead to Where Integration Actually Happens

Progress in RF rarely arrives and suddenly rewrites the rules. What actually moves performance forward almost always happens in the seams, the interfaces, the choices that determine whether individual parts are allowed to work together, or forced to fight one another. So, when we look ahead in RF systems—from DC through millimeter-wave—the most important conversations aren’t about isolated materials or heroic devices. They’re about integration, and more specifically, about how ceramic-based RF packages and module architectures shape system-level behavior long before the signal ever reaches free space.

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March 17, 2026

Below the Surface: From Substrate to System—Why Integration Is the Real RF Breakthrough

In my last column, I described the ceramic substrate itself, and why material choice matters so deeply in RF, microwave, and millimeter-wave applications. Dielectric constant, loss tangent, thermal conductivity, stability across temperature, and frequency are the physical rules that govern whether a signal arrives intact or collapses into noise.

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February 25, 2026

Below the Surface: Ceramic Circuits—The Most Important Electronics You’ll Never See Working

I decided to write this column to explain, plainly and honestly, how advanced packaging technologies work, and how they help engineers build better products. Ceramic circuits are a good place to start, because they remind us that the most important parts of great electronics are often the ones no one sees, until they’re gone.

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