Learning With Leo

Column from: Leo Lambert

Leo Lambert is technical director at EPTAC. He oversees course content and provides expert consultation to customers, leveraging over 40 years of experience in the electronics manufacturing industry. Renowned for his specific expertise in soldering, metallurgy, and cleaning processes, Leo has co-authored leading industry publications such as the IPC-A-600 Training Program, The Acceptability of Printed Boards, and authored the seminal text “Soldering for Electronic Assemblies.” He has presented numerous papers, chaired major assembly committees, and participated in developing influential manufacturing standards while earning recognition such as induction into the Global Electronics Association’s Raymond E. Pritchard Hall of Fame and the President’s Award. Lambert’s contributions extend globally as a charter member of key IPC committees, technical advisor for manufacturing process development, and an active participant in United Nations environmental initiatives to reduce CFCs.


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November 05, 2025

Learning With Leo: UHDI—The Next Leap in PCB Manufacturing

High density interconnect (HDI) technology has been a cornerstone of miniaturized electronics since Hewlett-Packard introduced the first chip-scale implementation in 1982. Over time, HDI processes became central to organic flip-chip packaging in the semiconductor industry. Today, the convergence of IC substrates and system-level PCBs has accelerated the adoption of UHDI.
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