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Cleaning for Reliability
SMT007 Magazine’s June issue examines how cleaning processes, contamination control, and reliability engineering are evolving to support highly dense assemblies, advanced packaging, and next-generation electronics manufacturing.
Spotlight on North America
A North America spotlight exploring tariffs, reshoring, AI demand, and supply chain challenges. Plus, insights on cybersecurity, workforce development, and the evolving role of U.S. electronics manufacturing.
Wire Harness Solutions
Explore what’s shaping wire harness manufacturing, and how new solutions are helping companies streamline operations and better support EMS providers. Take a closer look at what’s driving the shift.
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Learning With Leo
Column from: Leo Lambert
Leo Lambert is technical director at EPTAC. He oversees course content and provides expert consultation to customers, leveraging over 40 years of experience in the electronics manufacturing industry. Renowned for his specific expertise in soldering, metallurgy, and cleaning processes, Leo has co-authored leading industry publications such as the IPC-A-600 Training Program, The Acceptability of Printed Boards, and authored the seminal text “Soldering for Electronic Assemblies.” He has presented numerous papers, chaired major assembly committees, and participated in developing influential manufacturing standards while earning recognition such as induction into the Global Electronics Association’s Raymond E. Pritchard Hall of Fame and the President’s Award. Lambert’s contributions extend globally as a charter member of key IPC committees, technical advisor for manufacturing process development, and an active participant in United Nations environmental initiatives to reduce CFCs.