Driving Innovation

Driving Innovation: Size Matters—Navigating the Challenges of XXL PCB Production

Column By: Kurt Palmer

March 02, 2026

In high-end electronics, complexity is often measured in microns. However, when those microns are spread across a massive surface area, the engineering challenge fundamentally changes. Imagine two panels: Both are highly complex, featuring 4-stage build-ups, 2-mil line and space patterns, 2-mil microvias, and through-holes with a demanding 1:30 aspect ratio.

Driving Innovation: People Driving Precision in PCB Processes

Column By: Simon Khesin

February 03, 2026

The technology behind PCB production is both complex and fascinating. It represents a precise mix of different technologies and disciplines—mechanical, optical, and chemical—all working in concert. Yet, people are the most vital component in perfecting these solutions. I’d like to share how the specialized roles at Schmoll Maschinen GmbH in Germany contribute to the company’s commitment to excellence.

Driving Innovation: The Flash Cutting Process

Column By: Simon Khesin

December 08, 2025

During the creation of a multilayer board, the lamination process naturally results in excess resin (known as "flash)" being squeezed out and solidified along the sides of the PCB panel. While the consistency and size of this flash provide process engineers with valuable insight into lamination parameters, the flash itself must be completely removed before subsequent manufacturing steps.

Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production

Column By: Kurt Palmer

October 28, 2025

Rigid-flex printed circuit boards are a highly effective solution for placing complex circuitry in tight, three-dimensional spaces. They are now indispensable across a range of industries, from medical devices and aerospace to advanced consumer electronics, helping designers make the most efficient use of available space. However, their unique construction—combining rigid and flexible materials—presents a fundamental challenge for PCB manufacturers.

Driving Innovation: Mastering Panel Warpage

Column By: Simon Khesin

September 23, 2025

During the complex and multi-step process of PCB fabrication, a panel's flatness is constantly at risk. A host of factors can introduce warpage, bending, and unevenness, presenting a fundamental challenge to achieving high-precision results. This deformation (sometimes referred to as “bow and twist”), even on a microscopic scale, can lead to critical defects during subsequent stages, such as component surface mounting (e.g., tombstoning, solder opens) and the PCB's long-term functional reliability.

Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs

Column By: Kurt Palmer

September 08, 2025

In PCB manufacturing, the demand for increasingly complex and miniaturized designs continually pushes the boundaries of traditional fabrication methods, including depth routing. Success in these applications demands not only on robust machinery but also sophisticated control functions. PCB manufacturers rely on advanced machine features and process methodologies to meet their precise depth routing goals. Here, I’ll explore some crucial functions that empower manufacturers to master complex depth routing challenges.

Driving Innovation: Inner Layer Alignment Methods in PCB Production

Column By: Kurt Palmer

August 06, 2025

In PCB manufacturing, precision is a fundamental requirement. Among many complex processes, the accurate registration of inner layers before lamination is one of the most critical. Much like a child's game where rings must be perfectly stacked onto a single pin, PCB manufacturers align multiple conductive and insulating layers to form a cohesive, functional board. This alignment directly affects PCB precision; tighter layer alignment results in smaller "annular rings," superior performance, and higher yields.

Driving Innovation: Direct Imaging vs. Conventional Exposure

Column By: Simon Khesin

July 01, 2025

My first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.

Driving Innovation: Traceability in PCB Production

Column By: Kurt Palmer

May 29, 2025

Traceability across the entire printed circuit board production process is an increasingly important topic among established manufacturers and companies considering new PCB facilities. The reasons are apparent: Automatic loading of part programs, connection with MES systems and collection of production data, and compliance with Industry 4.0 requirements

Driving Innovation: Registration in PCB Production Throughout the Process

Column By: Simon Khesin

May 06, 2025

PCB manufacturing is a fascinating industry where multiple disciplines—chemical, mechanical, and optical processes—intersect. Each field plays a crucial role, and missing even one step can significantly impact production and yield. In the realm of mechanical and optical processes, one of the most critical aspects influencing the final result—especially in complex PCB designs—is registration.

Driving Innovation: Schmoll—Decades of Technology Evolution

Column By: Kurt Palmer

March 24, 2025

In this first column we look back at Schmoll’s history, building a business of manufacturing PCB drilling machines, examining key technological milestones, and demonstrating how challenges were addressed over the years. In future columns, we will discuss current industry challenges, technological advancements, and anticipated trends shaping PCB manufacturing. Looking back at the past and reflecting on the lessons learned is always an insightful and valuable journey.