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Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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SMT Trends & Technologies
Column from: Eric Klaver
Eric Klaver was born in Rosemere, Quebec, and via Oklahoma, he moved with his family to Holland at the age of 12. After finishing school, he became a radio officer for the Merchant Navy. After studying computer science, where he learned how to program and design ICs, Klaver enjoyed a career at Philips. This was followed by a move to Assembleon in 1998.