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Cutting-edge Inspection Challenges

09/26/2023 | Brent Fischthal, Koh Young America
Koh Young’s Brent Fischthal explains how UHDI and advanced packaging are challenging inspection systems. He says the shift toward larger components and advanced packaging brings a host of challenges that impact the industry. These challenges include complexity, density, package diversity, and inspection methodologies, all of which necessitate a more innovative approach.

Towards a Silicon to Systems Industrial Strategy

09/25/2023 | Alison James
"Electronics systems are at the heart of almost all modern technology. The performance and functionality of these systems have increased at breathtaking speed, chiefly as a result of advancements in semiconductor technology. Semiconductors do not function in isolation," writes Alison James, IPC senior director of government relations, in a 2023 report for the European Commission’s Directorate General for Internal Market, Industry, Entrepreneurship. "These electronics systems feature prominently in key sectors like defence, aerospace, space, automotive, medical, and high-performance computing, but electronics are vital to every industry and are central to a variety of EU priorities, including the twin digital and green transitions and Europe’s technological sovereignty."

Nanusens Technology is Key to Enabling AI to be Smarter

09/25/2023 | Nanusens
The problem at the moment is that sensors are currently manufactured on a tiny sliver of silicon, or die, by a small number of specialist companies with each sensor type being produced on a dedicated production line so it is hard to ramp up production.

Trouble in Your Tank: Processes to Support IC Substrates and Advanced Packaging, Part 4

09/28/2023 | Michael Carano -- Column: Trouble in Your Tank
In a previous column, the critical process of desmear and its necessity to ensure a clean copper surface connection was presented. Now, my discussion will focus on obtaining a void-free and tightly adherent copper plating deposit on these surfaces. After the desmear process, the task is to insure a continuous, conductive, and void-free deposit on the via walls and capture pad. Today, there are several processes that can be utilized to render vias conductive.

Global Sourcing Spotlight: Meeting the Challenges of Global Sourcing

09/26/2023 | Bob Duke -- Column: Global Sourcing Spotlight
Sourcing goods and services from around the world can offer many benefits, such as cost savings and access to a wider and better range of products and services, but it also presents many challenges, especially for amateurs. Global sourcing is a game for experienced experts. The path to global sourcing is riddled with stories of failures and catastrophes, from losing a wire payment for your supplier overseas to theft of proprietary intellectual property. In short, you have to know what you’re doing before you take the leap to global sourcing.
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