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The Impact of Vias on PCB AssemblyNovember 17, 2016 | Stephen Las Marias, I-Connect007
Estimated reading time: 1 minute
The continuing trend towards smaller and smaller devices with even more functionality has resulted in a dramatic reduction in the size of components, silicon packages, and the PCBs themselves. Component technologies such as BGAs and CSPs have challenged PCB manufacturing technologies due to the number of input/output connections and tighter and tighter pitches associated with these devices. Don’t forget the costs associated with fabrication.
Via technology—including blind and buried—has been one of the solutions to address the miniaturization and component density challenges in current electronic assemblies. Advantages include improved electrical and thermal performance; increased wiring density; space-saving in PCBs; placement of even more chips and components in PCBs; and finally, smaller PCBs.
Source: I-Connect007 Survey
However, vias are not without their own set of challenges. In our recent survey that focused on vias, respondents mentioned challenges such as impedance matching, routing, placement of vias, minimum size limitations, aspect ratio, and the limitations for the PCB manufacturer. One respondent commented: “In-pad vias in thermal pads and regular lands often cause processing issues. If they are tented, trapped residues and ‘popping’ are issues. If they are not tented, solder thieving is an issue. We have also tried using solder mask dams on the pad to prevent thieving with poor results. We also don't want to add more vias than necessary to meet the thermal target. In this case, more is not necessarily better as it may increase voiding at the thermal interface.” He added that more vias increase the drill time at the PCB fabricator side, and may increase cost.
Reliability is also an issue, per our survey. One respondent said that their QA department is concerned that tenting vias leaves contaminants in vias, which can affect the long-term reliability of the PCB assembly. He noted, though, that tenting vias help minimize solder problems, so he always tents vias. Apart from tenting, via filling, mask covering and plating are also challenges when dealing with vias.
To read this entire article, which appeared in the November 2016 issue of SMT Magazine, click here.
Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Dynamic Grid has ordered a Hentec Industries/RPS Valence 3508 selective soldering system.
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Capital Expo & Tech Forum taking place on March 7 at Sweeney Barn in Manassas, Virginia.
Repair of soldered components is a constant necessity in the electronics industry. Product performance enhancement, damaged components, and exchange of wrong placed components are some of the motivations behind a repair. Dispensing and placing a 400 μm pitch component manually is very time consuming and could cause collateral damage to the already populated components. A novel automatic repair method and tools with no human interaction were developed. Learn about this method…
The SMTA Capital Chapter is excited to announce the upcoming SMTA Capital Chapter Expo and Tech Forum, scheduled for March 7th, 2024, at Sweeny Barn in Manassas, Virginia.
The opening session of the second day’s conference proceedings focused on global PCB trends and was introduced and moderated by Dr. Michele Stampanoni, vice president of strategic sales and business development at Cicor Group in Switzerland. He opened the session with Dr. Hayao Nakahara’s knowledgeable and enlightening video presentation on the IC substrates industry.