Marcy’s Musings: Advancing the Advanced Materials Discussion
The Marketing Minute: Cracking the Code of Technical Marketing
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
Real Time With...HKPCA & IPC Show 2016: Orbotech Highlights Need for Industry 4.0
December 14, 2016 | Real Time With... HKPCA & IPC Show 2016Estimated reading time: Less than a minute
At the recent HKPCA and IPC Show 2016 in Shenzhen, China, Shavi Spinzi, director of industry marketing, PCB Division, at Orbotech, speaks with Editor Stephen Las Marias about the latest trends happening in the PCB manufacturing industry, and the market growth drivers.
He explains why the PCB manufacturing industry needs to move to Industry 4.0, and talks about how Orbotech can help them in their Industry 4.0 journey.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Richardson Electronics Appoints Daniel Albers to Drive Made-in-USA Contract Manufacturing Expansion
09/17/2025 | Globe NewswireRichardson Electronics, Ltd., a global provider of engineered solutions for the green energy, power management, and custom display markets, announced the appointment of Daniel Albers to spearhead business development for its expanded, Made-in-USA contract manufacturing efforts.
GlobalFoundries Joins World Economic Forum’s Global Lighthouse Network for Manufacturing Excellence
09/17/2025 | GlobalFoundriesGlobalFoundries announced that the World Economic Forum (WEF) has designated its 300mm fab in Singapore as part of the Global Lighthouse Network (GLN) of advanced manufacturers.
STMicroelectronics to Advance Next-generation Chip Manufacturing Technology with New PLP Pilot Line in Tours, France
09/17/2025 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, today announced new details regarding the development of the next generations of Panel-Level Packaging (PLP) technology through a pilot line in its Tours site, France, which is expected to be operational in Q3 2026.
Indium President and CEO to Deliver ELCINA CEO Forum Keynote at Productronica India
09/17/2025 | Indium CorporationIndium Corporation President and CEO Ross Berntson will deliver the Electronic Industries Association of India (ELCINA) CEO Forum keynote at Productronica India, to be held September 17-19 in Bengaluru, India.
Technica USA Advocates for PCBAA Membership Among Printed Circuit Assembly Customers
09/16/2025 | Technica USATechnica USA is actively encouraging its printed circuit assembly customers to join the Printed Circuit Board Association of America (PCBAA), a leading industry organization advocating for increased domestic production of printed circuit boards (PCBs) and substrates.