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Current IssueAlternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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Matrix USA to Display Full Product Line at IPC APEX 2017
January 23, 2017 | Matrix USA Inc.Estimated reading time: 1 minute
Matrix USA invites all PCB industry fabricators to Booth #3701 at the 2017 IPC APEX Expo in San Diego, CA starting February 14. Matrix will be featuring the latest circuit board materials from industry-leading suppliers, including:
- PANASONIC multilayer & flex laminates such as Megtron 7, Megtron 4S, and Felios Flex (LCP). All materials will be displayed with full technical features with qualified personnel on hand to discuss applications.
- JINZHOU drills, routers, endmills and the PERFECT POINT drill repointing service
- ACF Supported copper foils, made with CIRCUIT FOIL high quality ED copper foils
- KINGBOARD Rigid Laminates including KB6167F (Tg 175 °C), KB6160A (Tg 135 °C) and KB6164F (Tg 140 °C).
- HAKUTO Auto Dry Film Lamination
Matrix will also have a full option next generation Hakuto Mach 6630NP auto dry film laminator on display at the show featuring,
- The NEW even heat and even pressure module
- Quick change lamination rolls
- Cassette loading of dry film (off-line)
- Enclosed cabinet to minimize contaminates
- Stationary Film Loading Bay
- And more…
Visit Matrix at the IPC APEX Expo to speak with one of their technical professionals and learn more about all of their product offerings in Booth 3701.
About Matrix USA Inc.
Committed to the motto, “Quality Products, Dependable People”, Matrix was established in 1977 with the objective of providing quality raw materials to the North American Printed Circuit Board Industry. Matrix has four rapid-response warehouses located throughout the US and Canada that fulfill high quality, fast delivery, and custom orders daily. For further information, click here.
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10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
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PCB007 Magazine October 2024: Alternate Metallization Processes
10/16/2024 | I-Connect007 Editorial TeamTraditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop taking us into new directions. In this issue of PCB007 Magazine, we examine the impact of alternate metallization methods giving a glimpse into how and when we will arrive at 'destination metallization'.
Partial HDI: A Complete Solution
10/10/2024 | I-Connect007 Editorial TeamWe recently spoke with IPC instructor Kris Moyer about partial HDI, a process that’s recently been growing in popularity. Partial HDI allows designers to escape route out from tight-pitch BGAs on one layer, where a mechanically drilled plated through-hole is not an option, while avoiding the complexity and expense of sequential lamination cycles. As Kris explains, this process doesn’t add much to the cost, and it’s fairly straightforward. But there are some competing signal integrity and fabrication requirements to contend with. We asked Kris to walk us through this process.