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Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
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Matrix USA to Display Full Product Line at IPC APEX 2017
January 23, 2017 | Matrix USA Inc.Estimated reading time: 1 minute
Matrix USA invites all PCB industry fabricators to Booth #3701 at the 2017 IPC APEX Expo in San Diego, CA starting February 14. Matrix will be featuring the latest circuit board materials from industry-leading suppliers, including:
- PANASONIC multilayer & flex laminates such as Megtron 7, Megtron 4S, and Felios Flex (LCP). All materials will be displayed with full technical features with qualified personnel on hand to discuss applications.
- JINZHOU drills, routers, endmills and the PERFECT POINT drill repointing service
- ACF Supported copper foils, made with CIRCUIT FOIL high quality ED copper foils
- KINGBOARD Rigid Laminates including KB6167F (Tg 175 °C), KB6160A (Tg 135 °C) and KB6164F (Tg 140 °C).
- HAKUTO Auto Dry Film Lamination
Matrix will also have a full option next generation Hakuto Mach 6630NP auto dry film laminator on display at the show featuring,
- The NEW even heat and even pressure module
- Quick change lamination rolls
- Cassette loading of dry film (off-line)
- Enclosed cabinet to minimize contaminates
- Stationary Film Loading Bay
- And more…
Visit Matrix at the IPC APEX Expo to speak with one of their technical professionals and learn more about all of their product offerings in Booth 3701.
About Matrix USA Inc.
Committed to the motto, “Quality Products, Dependable People”, Matrix was established in 1977 with the objective of providing quality raw materials to the North American Printed Circuit Board Industry. Matrix has four rapid-response warehouses located throughout the US and Canada that fulfill high quality, fast delivery, and custom orders daily. For further information, click here.
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Rachael Temple - AlltematedSuggested Items
Trouble in Your Tank: Understanding Interconnect Defects, Part 1
11/04/2025 | Michael Carano -- Column: Trouble in Your TankThis month, I’ll address interconnect defects (ICDs). While this defect continues to rear its ugly head, don’t despair. There are solutions, most of which center on process control and understanding the relationship of the chemistry, materials, and equipment. First, though, let’s discuss ICDs.
Target Condition: Distribution of Power—Denounce the Ounce
11/05/2025 | Kelly Dack -- Column: Target ConditionHave you ever wondered why the PCB design segment uses ounces to describe copper thickness? There’s a story behind all of this—a story that’s old, dusty, and more than a little absurd. (Note that I didn’t add “Like many of us.”) Legend has it that back in the days of copper tinkers and roofing tradesmen, the standard was set when a craftsman hammered out a sheet of copper until it weighed one ounce, when its area conveniently matched the square of the king’s foot.
WestDev Announces Advanced Thermal Analysis Integration for Pulsonix PCB Design Suite
10/29/2025 | WestDev Ltd.Pulsonix, the industry-leading PCB design software from WestDev Ltd., announced a major enhancement to its design ecosystem: a direct interface between Pulsonix and ADAM Research's TRM (Thermal Risk Management) analysis software.
Designers Notebook: Power and Ground Distribution Basics
10/29/2025 | Vern Solberg -- Column: Designer's NotebookThe principal objectives to be established during the planning stage are to define the interrelationship between all component elements and confirm that there is sufficient surface area for placement, the space needed to ensure efficient circuit interconnect, and to accommodate adequate power and ground distribution.
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.