-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueIn Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
AT&S Provides PCB Technology and System Integration Expertise to World’s Smallest Speaker
February 7, 2017 | AT&SEstimated reading time: 2 minutes

Graz-based start-up USound, in partnership with several Fraunhofer Institutes (IDMT, ISIT, IIS and IZM) and utilizing PCB technology together with system integration expertise from AT&S, has developed what is not only the world’s smallest speaker, but also the first based on micro-electro-mechanical systems (MEMS). The product is protected with numerous patents. MEMS are silicon chips or substrates with very small feature sizes, that have mechanical and electrical functions at the same time. They make it possible to implement extremely compact, reliable and energy-efficient solutions. With dimensions of just 5 mm x 7 mm x 2 mm, the micro-speaker has a frequency range of 2-15 kHz.
AT&S is a technology partner of USound. Development of the MEMS micro-speaker would not have been possible without innovations in materials, silicon integration and packaging. Thanks to state-of-the-art packaging solutions, the MEMS loudspeaker itself, its drive circuits (application-specific integrated circuits, ASIC) and passive elements can be integrated into a tiny component with an extremely small form factor.
To manufacture ultra-small components of this kind, innovative system integration is essential in addition to state-of-the-art printed circuit board (PCB) technology. Thus AT&S have developed not only optimised PCB technology, but also special process engineering solutions for component and semiconductor packaging – from embedding passive components to complete System-in-Boards (SiB) and System-in-Packages (SiP). A wide range of innovative products based on AT&S technologies are manufactured in large volumes, from miniaturised computer boards to medical sensor products and MEMS microphones – and now MEMS speakers too.
While MEMS components are widely used as acceleration and tilt sensors, and as microphones, in smartphones, wearables and vehicles, MEMS-based speakers did not exist until now. By eliminating the coil and magnet found in conventional solutions, MEMS speakers achieve extremely small dimensions along with low power consumption and very good sound quality.
USound will transfer the presented technology into mass production. The new generation of speakers based on semiconductor technology is set to come to market in 2018. They will require only half as much space and 80 percent less power than their predecessors. USound is also aiming to create better sound quality with its MEMS speakers than with conventional speakers.
About USound GmbH
USound GmbH is a fast growing audio start-up, founded with the mission of developing and producing the most advanced audio systems for mobile applications based on MEMS technology. The patented technological platform developed by USound is enabling the production of a new, revolutionary generation of MEMS micro speakers for wide-ranging mobile applications. USound is a fabless company: process R&D and manufacturing operations are outsourced to world class industrial partners. For more information, visit www.usound.com
Suggested Items
Adeon Technologies Signs Agreement as Distribution and Service Partner for PMT Global
06/13/2025 | Adeon Technologies BVAdeon Technologies has signed an agreement as Distribution and Service partner with PMT Global from Germany for its high precision measurement range of products.
Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology, Inc. That Achieves Yields Greater Than 99% for Underfilling During Semiconductor Manufacturing
06/11/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. edwd
DuPont/Qnity Innovators in Semiconductor Materials Named 2025 Heroes of Chemistry
06/10/2025 | DuPontDuPont today announced that 13 of its current and former scientists and engineers have been named 2025 Heroes of Chemistry by the American Chemical Society (ACS) for an innovative program that progressed semiconductor lithography.
Zhen Ding Promotes Digital Transformation and Embraces AI Business Opportunities
06/06/2025 | Zhen Ding TechnologyOn May 27, 2025, General Manager Chen-Fu Chien of Zhen Ding Technology Group was invited to attend the "2025 Two Thousand Forum" held by The CommonWealth Magazine.
Leidos Using Quantum Technology to Thwart GPS Jamming
06/05/2025 | PRNewswireSusceptibility to jamming is a significant military vulnerability of the Global Positioning System (GPS) signal. Through a Defense Innovation Unit contract, Leidos is developing an alternative navigation technology that measures variations in the Earth's magnetic field and harnesses the quantum properties of nitrogen in diamonds.