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From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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Best Technical Paper at IPC APEX EXPO 2017 Selected
February 8, 2017 | IPCEstimated reading time: 1 minute
The best technical conference paper of IPC APEX EXPO 2017 has been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Program Committee, the paper authors will receive their awards during the opening keynote session on Tuesday, February 14.
Taking top honors, the winning paper is, “Rework of New High Speed Press Fit Connectors” by Lars Bruno, Ericsson AB. This paper will be presented during Technical Conference Session 34 on Thursday, February 16.
This year, two papers were selected in the honorable mention category. Honorable mention went to, “Effect of Encapsulation Materials on Tensile Stress during Thermo-Mechanical Cycling of Pb-Free Solder Joints” by Maxim Serebreni, DfR Solutions. His co-authors were: Nathan Blattau, Ph.D., Gilad Sharon, Ph.D., and Craig Hillman, Ph.D., all of DfR Solutions. This paper will be presented during Technical Conference Session 22 on Thursday, February 16.
Honorable mention also goes to “SIR Intercomparison to Validate the Use of a Fine Pitch Pattern” by Christopher Hunt, Gen3 Systems. The paper was co-authored by Ling Zou, National Physical Laboratory. This paper will be presented during Technical Conference Session 9 on Tuesday, February 14.
The papers were evaluated on their technical content, originality, test procedures and data used to deduce conclusions, quality of illustrations and the clarity and professionalism of writing as well as value to the industry.
To register for the IPC APEX EXPO technical conference or for more information on all the activities taking place including standards development committee meetings, professional development courses, the exhibition and more, click here.
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