Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Libra Industries Upgrades Speed on its ACE Selective Solder System
February 21, 2017 | Libra IndustriesEstimated reading time: 1 minute
Libra Industries is pleased to announce that it has upgraded the software on its ACE K.I.S.S. 102 selective solder machine. With the new software and drive system, Libra Industries' ACE K.I.S.S. 102 runs up to 30 percent faster and the programming time has been reduced by at least 50 percent. Additionally, the new software has a better user interface along with dual screens to watch the product run and detect issues early on.
The K.I.S.S 102 is an automated, simple to use low cost selective soldering machine using the proven "traveling mini–solder wave," featuring the "Super fast" robotic motion to maximize production. It is used to flux and solder through-hole components on SMT boards within close proximity of adjacent components. This process overcomes the limitations of operator dependent soldering with a truly flexible automated flux application and molten solder delivery system.
The K.I.S.S 102 couples high throughput with precise process controls. The programmable features provide the tools to set all process parameters, including immersion depths, preheat dwells, travel distances and speeds, solder temperature, and wave height. Once set, the system will repeat precisely.
Libra Industries continues to invest to provide customized manufacturing solutions to help make its customers more competitive and improve their profitability. For more information, visit www.libraind.com.
About Libra Industries
Libra Industries is a leading provider of integrated Electronic Manufacturing Services (EMS), serving OEMs with complex or technologically sophisticated manufacturing requirements in a broad range of industries including industrial automation, medical, military and aerospace, instrumentation and LED lighting. Five world-class manufacturing facilities allow Libra Industries to provide customers with manufacturing flexibility including complete system build, module and subassembly production, as well as simple to complex PC board assembly. With an ongoing commitment to investment in people, quality systems, and the latest manufacturing equipment and processes, Libra Industries is committed to managing their clients’ products from initial design and prototype to full production; assisting their clients in their efforts to improve time to market, reduce total systems cost, and increase quality.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.