The Chemical Connection: How We Deal With a Technology Roadmap
It’s Only Common Sense: 10 Lessons for New Salespeople
Trouble in Your Tank: Interconnect Defect—The Three Degrees of SeparationRTW IPC APEX EXPO: The Power of Synergies with MacDermid Enthone and Alpha Assembly Solutions
March 16, 2017 | Real Time with...IPCEstimated reading time: Less than a minute
Don Cullen, global director of marketing communications with MacDermid Enthone, and Tom Hunsinger, VP global marketing with Alpha Assembly Solutions explain the structure of MacDermid Performance Solutions, which combines the former MacDermid, Enthone and Alpha Assembly Materials businesses to provide PCB and EMS industries with enhanced innovation and service throughout the supply chain, with unified sales strategies and improved processes.
Share on:
Suggested Items
IPC Recommends Greater Focus on Electronics Needed for US-based AI Data Centers
10/07/2024 | IPCA new white paper from IPC, “AI-based Data Centers for the United States: Technologies, Supply Chains, and Resiliency Gaps,” explores the actions needed to improve the supply chain resiliency of U.S.-based artificial intelligence (AI) data centers and the electronics used in them.
AIM to Present on Ultra-Miniature Component Assembly at SMT-Info
10/02/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMT-Info Technical Conference taking place October 15-16 in Brno, Czech Republic.
PCB Surface Topography and Copper Balancing Under Large Form Factor BGAs
10/01/2024 | Neil Hubble, Akrometrix and Gary A. Brist, Intel CorporationAs CPU and GPU packages grow larger and contain higher pin/ball counts, the importance of managing the printed circuit board (PCB) surface coplanarity for package assembly increases. The PCB surface coplanarity under a package is a product of both the global bow/twist of the PCB and the local surface topography under the package. In general, the surface topography is dependent the choice of material and layer stackup and the interaction between the innerlayer copper patterns and prepreg resin flow.
Real Time with... SMTA Guadalajara 2024: From Taiwan to Mexico: TRI's Expansion
09/26/2024 | Real Time with... SMTA GuadalajaraSpeaking with Nolan Johnson is Fernando Salomon, sales manager for Test Research, Inc., discussing TRI's increasing presence in Mexico, particularly in Guadalajara. Salomon explains that TRI recognizes the importance of the Mexican market and has invested in local offices and staff.
ASC Sunstone Circuits to Present Lunch and Learn and Exhibit at PCB West 2024
09/24/2024 | ASC SunstoneASC Sunstone Circuits will be exhibiting at PCB West 2024 Conference and Exhibition to be held from October 8th through the 11th at the Santa Clara Convention Center in Santa Clara, California.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in