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Advancing the Advanced Materials Discussion
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Copper Foil Maker Co-Tech Positive About 2017 Outlook
April 25, 2017 | DigitimesEstimated reading time: Less than a minute
Co-Tech Copper Foil has expressed optimism about its performance during 2017 citing robust copper foil demand, according to Digitimes. The company generated revenues of about NT$5.4 billion ($178.5 million) in 2016, up by 26.5% on year, while gross margin surged to 18.57% from 3.65% in 2015.
Co-Tech credited its positive performance to a significant increase in car-use copper foil demand particularly that from China, as well as rising prices of copper materials. The company returned to profitability in 2016 following five years of losses.
About Co-Tech
Co-Tech's headquarters are in Taipei, Taiwan. The Copper foil and CuO plant are located in Yulin, Taiwan.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Elephantech to Exhibit at Semicon Japan 2025
11/28/2025 | ElephantechFrom December 17–19, Elephantech will be exhibiting at Semicon Japan 2025 at Tokyo Big Sight.
Elephantech to Showcase Thick-Copper FPC and Ultra-Fine Copper Nanofiller at AABC 2025
11/26/2025 | ElephantechElephantech will be exhibiting at AABC 2025, held from December 9-11, in Las Vegas, USA.
Connect the Dots: The Future of Designing for Reality—Electroless Copper
11/26/2025 | Matt Stevenson -- Column: Connect the DotsOn a recent episode of I-Connect007’s On the Line With… podcast, we discussed electroless copper deposition—depositing a thin copper layer into the through-holes and vias of what will eventually become a printed circuit board. Specifically, it is a chemically catalyzed deposition of copper, mainly to the epoxy inside the holes (as well as on the entire surface of the board). Electroless differs from electrolytic in that electrolytic deposition relies on electricity.
NcodiN Secures €16M Seed Round to Break AI’s Main Bottleneck with the World’s Smallest Laser
11/21/2025 | BUSINESS WIRENcodiN, the deep-tech startup pioneering optical interposer technology with integrated nanolasers, has secured €16 million in oversubscribed Seed financing round.
Rubin’s Cableless Architecture and ASIC High-Layer HDI Designs Push PCBs to the Center of AI Compute Power
11/20/2025 | TrendForceTrendForce’s latest research points out that AI server design is undergoing a fundamental structural shift. From NVIDIA’s Rubin platform featuring a fully cableless architecture, to hyperscalers’ in-house ASIC servers adopting ultra-high-layer HDI designs, PCBs are no longer merely passive circuit carriers—they are becoming a core enabler of compute performance.