Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
SMTA Capital Chapter Expo and Tech Forum to be Held on August 24
July 11, 2017 | SMTAEstimated reading time: Less than a minute
The SMTA Capital Chapter is inviting the industry to its upcoming Capital Expo and Tech Forum, which will be held at Johns Hopkins University/Applied Physics Lab, Kossiakoff Center, 11100 Johns Hopkins Road, Laurel, Maryland, on August 24.
During this year's expo, the Capital Chapter will host technical presentations by ITM Consulting, Summit Interconnect, and GVD Corp. Specific topics include "The 'Deadly Sins' of SMT Assembly," "Density, Advanced Materials and Cost Drivers Associated with Advanced Circuit Design, Fabrication and Assembly," and, "Reliability without Hermeticity: Commercial Vapor Deposited Coatings for High-Frequency RF Micro-Electronics."
Registration opens at 8 am and includes a complimentary lunch on the show floor. Exhibits are open from 9-3 pm and the first technical presentation will start at 9:30 am.
To register online to attend or exhibit, please click here.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Indium President and CEO to Deliver ELCINA CEO Forum Keynote at Productronica India
09/17/2025 | Indium CorporationIndium Corporation President and CEO Ross Berntson will deliver the Electronic Industries Association of India (ELCINA) CEO Forum keynote at Productronica India, to be held September 17-19 in Bengaluru, India.
Curing and Verification in PCB Shadow Areas
09/17/2025 | Doug Katze, DymaxDesign engineers know a simple truth that often complicates electronics manufacturing: Light doesn’t go around corners. In densely populated PCBs, adhesives and coatings often fail to fully cure in shadowed regions created by tall ICs, connectors, relays, and tight housings.
Variosystems Strengthens North American Presence with Southlake Relaunch 2025
09/15/2025 | VariosystemsVariosystems celebrated the relaunch of its U.S. facility in Southlake, Texas. After months of redesign and reorganization, the opening marked more than just the return to a modernized production site—it was a moment to reconnect with our teams, partners, and the local community.
MacDermid Alpha Presents at SMTA New Delhi, Bangalore Chapter, on Flux–OSP Interaction
09/09/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha contributes technical insights on OSP solderability at the Bangalore Chapter, SMTA reinforcing commitment to knowledge-sharing and industry collaboration.
Naprotek Appoints Mark Crebs to Lead Business Development for Products and Platforms
08/27/2025 | Naprotek LLCNaprotek, LLC, a leading provider of mission-critical electronics technology solutions, announced the appointment of Mark Crebs to Products and Platform Director of Business Development.